Title:
CUTTING TOOL AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2018/047733
Kind Code:
A1
Abstract:
Disclosed is a cutting tool comprising a base material and a film provided on the base material, wherein: the base material is a cBN sintered compact including greater than or equal to 30 vol% to less than 80 vol% of cBN, and a binding material; the film includes a compound layer made of a composition of Ti1-xAlxC1-aNa (0.70≤X≤0.95; 0
Inventors:
TSUKIHARA NOZOMI (JP)
SETOYAMA MAKOTO (JP)
PASEUTH ANONGSACK (JP)
SETOYAMA MAKOTO (JP)
PASEUTH ANONGSACK (JP)
Application Number:
PCT/JP2017/031572
Publication Date:
March 15, 2018
Filing Date:
September 01, 2017
Export Citation:
Assignee:
SUMITOMO ELECTRIC HARDMETAL CORP (JP)
International Classes:
B23B27/14; B23B27/20; B23B51/00; B23C5/16; B23D77/00; B23F21/00; B23G5/06; C04B35/5831; C04B41/87; C22C1/05; C23C16/36
Domestic Patent References:
| WO2016052479A1 | 2016-04-07 |
Foreign References:
| JP2015030061A | 2015-02-16 | |||
| JP2015110258A | 2015-06-18 | |||
| JP2015178171A | 2015-10-08 | |||
| JP2008545063A | 2008-12-11 | |||
| JP2011516722A | 2011-05-26 | |||
| JP2011513594A | 2011-04-28 | |||
| JP2014004665A | 2014-01-16 |
Other References:
See also references of EP 3511097A4
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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