Title:
CUTTING TOOL AND CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/050467
Kind Code:
A1
Abstract:
[Problem] To provide a cutting method and a cutting tool for a hard brittle material, which improve the emission efficiency of laser light while avoiding total reflection of the laser light, and eliminate the need for excessive heating by laser light. [Solution] This cutting tool for cutting a hard brittle material is formed from a translucent material through which laser light can pass, and forms a rake angle. Laser light is propagated inside the cutting tool, and the cutting tool and hard brittle material are brought into contact such that at least a section in which the cutting tool and hard brittle material contact each other, and a section in which the rake angle is formed are irradiated with laser light. Laser light except for that subject to Fresnel reflection at the end surface of the cutting tool is radiated from said contact section and said rake angle formation section to the hard brittle material so as to soften the hard brittle material, and the softened hard brittle material is cut by the cutting tool.
Inventors:
YAMASHIDA HIRONORI (JP)
SUGIMURA TERUMICHI (JP)
SUGIMURA AKINORI (JP)
HORIGUCHI KOJI (JP)
IMAIZUMI NOBUO & X ECA;& X CC ;& X ;& X F ;& X B;
SUGIMURA TERUMICHI (JP)
SUGIMURA AKINORI (JP)
HORIGUCHI KOJI (JP)
IMAIZUMI NOBUO & X ECA;& X CC ;& X ;& X F ;& X B;
Application Number:
PCT/JP2013/073785
Publication Date:
April 03, 2014
Filing Date:
September 04, 2013
Export Citation:
Assignee:
NAMIKI PRECISION JEWEL CO LTD (JP)
ADAMANT KOGYO CO (JP)
ADAMANT KOGYO CO (JP)
International Classes:
B23B1/00; B23B27/20; B23C3/00; B23P25/00
Foreign References:
| JP2009509770A | 2009-03-12 | |||
| JP2012106325A | 2012-06-07 | |||
| US20040104207A1 | 2004-06-03 |
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