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Patent Searching and Data


Title:
CUTTING TOOL
Document Type and Number:
WIPO Patent Application WO/2022/114191
Kind Code:
A1
Abstract:
This cutting tool includes a rake face, a flank, and a cutting edge, which is a blade tip ridge line joining the rake face and the flank. In this cutting tool, a portion of the rake face and a portion of the flank adjacent to the cutting edge are composed of a diamond sintered body including diamond particles. The dislocation density in the portion of the flank is at most equal to 8×1015/m2. The average particle size of the diamond particles is between 0.1 μm and 50 μm inclusive. The content of the diamond particles in the diamond sintered body is between 80 percent by volume and 99 percent by volume inclusive.

Inventors:
IWASAKI HIROTSUGU (JP)
UEDA AKIHIKO (JP)
WATANOBE NAOKI (JP)
HARADA TAKASHI (JP)
KUKINO SATORU (JP)
Application Number:
PCT/JP2021/043682
Publication Date:
June 02, 2022
Filing Date:
November 29, 2021
Export Citation:
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Assignee:
SUMITOMO ELECTRIC HARDMETAL CORP (JP)
International Classes:
B23B27/20; B23B27/14; C04B35/52
Foreign References:
JP2005239472A2005-09-08
JPH0437650A1992-02-07
JP2016097452A2016-05-30
JP2020198392A2020-12-10
JP2005239472A2005-09-08
Other References:
PANTEA, C. GUBICZA, J. UNGAR, T. VORONIN, G.A. NAM, N.H. ZERDA, T.W.: "High-pressure effect on dislocation density in nanosize diamond crystals", DIAMOND AND RELATED MATERIALS, vol. 13, no. 10, 1 October 2004 (2004-10-01), NL , pages 1753 - 1756, XP004544802, ISSN: 0925-9635, DOI: 10.1016/j.diamond.2004.03.005
T. UNGARA. BORBELY: "The effect of dislocation contrast on x-ray line broadening: A new approach to line profile analysis", APPL. PHYS. LETT., vol. 69, no. 21, 1996, pages 3173, XP012016627, DOI: 10.1063/1.117951
T. UNGARS. OTTP. SANDERSA. BORBELYJ. WEERTMAN: "Dislocations, grain size and planar faults in nanostructured copper determined by high resolution X-ray diffraction and a new procedure of peak profile analysis", ACTA MATER., vol. 46, no. 10, 1998, pages 3693 - 3699, XP027395830
See also references of EP 4252940A4
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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