Title:
CYANIC ACID ESTER COMPOUND AND METHOD FOR PRODUCING SAME, RESIN COMPOSITION, CURED ARTICLE, PREPREG, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, ADHESIVE AGENT, METAL FOIL-CLAD LAMINATE PLATE, RESIN SHEET, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2017/170375
Kind Code:
A1
Abstract:
Provided are: a novel cyanic acid ester compound which has excellent solubility in solvents and makes it possible to produce a cured article having a low thermal expansion coefficient and excellent flame retardancy and heat resistance; a resin composition which contains the compound; and others. Provided is a resin composition which can be cured into a cured article that enables the provision of a printed wiring board having excellent peel strength, an excellent glass transition temperature, an excellent thermal expansion coefficient, an excellent water absorption rate and an excellent heat conductivity. Provided is a resin composition which can be cured into a cured article that enables the provision of a printed wiring board having a high glass transition temperature and a low thermal expansion property and also having an excellent bending elastic modulus and an excellent heat conductivity. A cyanic acid ester compound represented by general formula (1).
Inventors:
KOGA SHOTA (JP)
TAKANO KENTARO (JP)
KATAGIRI MASAYUKI (JP)
YASUDA YOSHIHIRO (JP)
TSUJIMOTO TOMOO (JP)
TAKANO KENTARO (JP)
KATAGIRI MASAYUKI (JP)
YASUDA YOSHIHIRO (JP)
TSUJIMOTO TOMOO (JP)
Application Number:
PCT/JP2017/012347
Publication Date:
October 05, 2017
Filing Date:
March 27, 2017
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G8/28; C08J5/24; C09J11/06; C09J201/00; H01L23/29; H01L23/31; H05K1/03
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Other References:
See also references of EP 3438146A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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