Title:
CYANIDE-FREE ALKALINE COPPER PLATING ELECTROPLATING SOLUTION FOR ZINC ALLOY DIE CASTING MEMBER, PREPARATION METHOD THEREFOR, AND ELECTROPLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/174632
Kind Code:
A1
Abstract:
Disclosed are a cyanide-free alkaline copper plating electroplating solution for a zinc alloy die casting member, a preparation method therefor, and an electroplating method. The electroplating solution comprises the following components: 5-50 g/L of main salt, 5-30 g/L of compounding adsorbent, and 200-400 g/L of complexing composition. By adding the compounding adsorbent on a cathode surface to change the copper ion concentration in a double layer, the copper ion potential of a cathode interface can be effectively reduced, the copper ion discharge and precipitation are inhibited, the "zinc-copper displacement reaction" is completely inhibited in an alkaline plating solution, the complex cooperation of the compounding adsorbent and the complexing composition is synergistic, and the effect of 1+1 being greater than 2 is achieved. The copper ion concentration in the double layer is changed, and the copper ion potential is effectively reduced, so that the copper ion discharge is more difficult, and the "zinc-copper displacement reaction" is completely inhibited in the alkaline plating solution; the technical problems that the zinc alloy die casting member is poor in cyanide-free copper plating bonding force and easy to bubble are solved; the plating crystallization is bright and fine, and the bonding force is firm.
Inventors:
ZHANG ZHILIANG (CN)
Application Number:
PCT/CN2021/131233
Publication Date:
August 25, 2022
Filing Date:
November 17, 2021
Export Citation:
Assignee:
ZHANG ZHILIANG (CN)
International Classes:
C25D3/38
Foreign References:
| CN113151870A | 2021-07-23 | |||
| CN111321436A | 2020-06-23 | |||
| CN105734622A | 2016-07-06 | |||
| CN102995077A | 2013-03-27 | |||
| US3775265A | 1973-11-27 |
Attorney, Agent or Firm:
BEIJING ZHONGPU HONGRU INTELLECTUAL (CN)
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