Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CYLINDER BORE WALL WARMING TOOL
Document Type and Number:
WIPO Patent Application WO/2018/225733
Kind Code:
A1
Abstract:
This cylinder bore wall warming tool comprises: a substrate member shaped so as to surround the entire periphery of the wall surface of a groove-shaped coolant channel on the cylinder bore side when viewed from above; a first expanding rubber which is secured to the inside of the substrate member, contacts the wall surface of the groove-shaped coolant channel on the cylinder bore side by expanding inside the groove-shaped coolant channel, warms the bore wall of the cylinder bore, and presses one half of the substrate member on one side thereof toward the wall surface on the opposite side of the groove-shaped coolant channel from the wall surface on the cylinder bore side; and a second expanding rubber which is secured to the inside of the substrate member, contacts the wall surface of the groove-shaped coolant channel on the cylinder bore side by expanding inside the groove-shaped coolant channel, warms the bore wall of the cylinder bore, and presses the other half of the substrate member toward the wall surface on the opposite side of the groove-shaped coolant channel from the wall surface on the cylinder bore side. As a result, the present invention provides an easily producible cylinder bore wall warming tool which is capable of warming a cylinder bore wall and is unlikely to cause a positional shift caused by vibrations or coolant flow.

Inventors:
SATOH JUNYA (JP)
Application Number:
PCT/JP2018/021562
Publication Date:
December 13, 2018
Filing Date:
June 05, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NICHIAS CORP (JP)
International Classes:
F02F1/14; F01P3/02
Domestic Patent References:
WO2016104478A12016-06-30
Foreign References:
JP2017089529A2017-05-25
JP2016128256A2016-07-14
JP2015203313A2015-11-16
JP2012007478A2012-01-12
Attorney, Agent or Firm:
ASHITABA INTERNATIONAL PATENT OFFICE (JP)
Download PDF: