Title:
CYLINDRICAL SPUTTERING TARGET PRODUCTION METHOD AND CYLINDRICAL SPUTTERING TARGET
Document Type and Number:
WIPO Patent Application WO/2018/180545
Kind Code:
A1
Abstract:
The production method for a cylindrical sputtering target according to the present invention comprises: a solder material applying step for forming a solder underlying layer on the inner peripheral surface of a sputtering target material and the outer peripheral surface of a backing tube; a cooling step for cooling the sputtering target material and the backing tube after the solder material applying step; an oxide removing step for removing an oxide produced on the surface of the solder underlying layer; and a solder bonding step for bonding the sputtering target material to the backing tube using a solder.
Inventors:
OKANO SHIN (JP)
NAGASE TOSHIYUKI (JP)
KATO SHINJI (JP)
NAGASE TOSHIYUKI (JP)
KATO SHINJI (JP)
Application Number:
PCT/JP2018/010225
Publication Date:
October 04, 2018
Filing Date:
March 15, 2018
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C23C14/34; B23K1/20
Foreign References:
| JP2014037619A | 2014-02-27 | |||
| JPH06128735A | 1994-05-10 | |||
| JP2010043357A | 2010-02-25 | |||
| JPH1046327A | 1998-02-17 | |||
| JP2002210555A | 2002-07-30 | |||
| JPH01179767A | 1989-07-17 | |||
| JP2017082280A | 2017-05-18 | |||
| JP2017066107A | 2017-04-06 | |||
| JP2014037619A | 2014-02-27 |
Other References:
See also references of EP 3604610A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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