Title:
CYLINDRICAL SPUTTERING TARGET, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/186385
Kind Code:
A1
Abstract:
The present invention includes: a surface treatment step in which a surface treating bonding material is applied to an inner circumferential surface, i.e. a bonding surface, of a cylindrical target (2), and/or an outer circumferential surface, i.e. a bonding surface, of a cylindrical backing tube (3), to form a surface treatment layer (11); and a bonding step which is performed after the surface treatment step, and in which a gap between the cylindrical target (2) and the backing tube (3) inserted into the cylindrical target is filled with a filling bonding material, and said filling bonding material is hardened. The melting point and the solidus temperature of the surface treating bonding material exceed the melting point and the solidus temperature of the filling bonding material.
Inventors:
MISHIMA AKIFUMI (JP)
KATO SHINJI (JP)
KATO SHINJI (JP)
Application Number:
PCT/JP2018/014240
Publication Date:
October 11, 2018
Filing Date:
April 03, 2018
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C23C14/34
Foreign References:
| JP2012132065A | 2012-07-12 | |||
| JP2016023325A | 2016-02-08 | |||
| JP2015145530A | 2015-08-13 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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