Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
DAMPER MOUNTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2012/035907
Kind Code:
A1
Abstract:
A damper mounting structure is provided with a top buffer member (27) and a bottom buffer member (28). The bottom buffer member (28) has a protruding section (44) that protrudes with an outer diameter smaller than the outer diameter of the bottom buffer member (28). The damper mounting structure mates with the protruding section (44) and is anchored to a vehicle body panel (17), and is provided with a collar (48) formed at substantially the same height (Hc) as the height (Hb) of the protruding section (44). The corner of an opening (41) formed on the vehicle body panel (17), which comes into contact with the top buffer member (27), is chamfered.

Inventors:
TAKAGI KAZUKI (JP)
KIHARA MAKOTO (JP)
HAYASHI MASANORI (JP)
MASUDA NORIAKI (JP)
Application Number:
PCT/JP2011/068038
Publication Date:
March 22, 2012
Filing Date:
August 08, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HONDA MOTOR CO LTD (JP)
TAKAGI KAZUKI (JP)
KIHARA MAKOTO (JP)
HAYASHI MASANORI (JP)
MASUDA NORIAKI (JP)
International Classes:
F16F9/54; B60G13/06; F16F1/36; F16F15/04
Foreign References:
JP2007276661A2007-10-25
JP2008075735A2008-04-03
JPH11170836A1999-06-29
JP2009085300A2009-04-23
JP2003042217A2003-02-13
JPH0885318A1996-04-02
Other References:
See also references of EP 2618020A4
Attorney, Agent or Firm:
SHIMODA, Yo-ichiro et al. (JP)
Yoichiro Shimoda (JP)
Download PDF:
Claims:



 
Previous Patent: CURRENT SENSOR

Next Patent: PARTS SUPPLYING ARTICLE