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Patent Searching and Data


Title:
DAMPING AND HEAT-INSULATION STRUCTURE, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/077404
Kind Code:
A1
Abstract:
A damping and heat-insulation structure, a preparation method therefor and an application thereof, relating to the technical field of protection of electronic components. The damping and heat-insulation structure is used for protecting a core component. The structure comprises a polyurethane damping layer, a restraint shell, a heat-insulation layer, a housing, and a heat-resistant layer from inside to outside. The preparation method comprises: synthesis and encapsulation molding of a damping layer material, processing molding of a heat-insulation tile structure, preparation of a restraint shell and a housing, assembly, connection and sealing of multiple structure layers, and preparation of a heat-resistant coating. By means of the superposition of the multiple structure layers and the sealing connection between the layers, the core element can work normally in a short-time high-temperature or instantaneous violent impact vibration environment. The structure features small size, ablation resistance, high temperature resistance, good water resistance, and strong vibration impact resistance.

Inventors:
XU YONG (CN)
TANG BO (CN)
ZHOU YUQI (CN)
SUN CHUNYAN (CN)
CHEN FENGBO (CN)
SUN NIJUAN (CN)
HU XIAOYAN (CN)
LIU QUNCE (CN)
ZHAO XIN (CN)
Application Number:
PCT/CN2019/113295
Publication Date:
April 29, 2021
Filing Date:
October 25, 2019
Export Citation:
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Assignee:
AEROSPACE RESEARCH INSTITUTE OF MATERIALS & PROCESSING TECH (CN)
International Classes:
B32B7/12; H05K5/00; B32B9/00; C08G18/10; H05K5/06
Foreign References:
CN104527181A2015-04-22
CN104527181A2015-04-22
CN108727028A2018-11-02
CN109532181A2019-03-29
US20170276220A12017-09-28
JP2015205451A2015-11-19
Attorney, Agent or Firm:
PATENT AGENT OF CHINA AEROSPACE TECHNOLOGY (CN)
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