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Patent Searching and Data


Title:
DAMPING PLATE
Document Type and Number:
WIPO Patent Application WO/2000/005518
Kind Code:
A1
Abstract:
A damping plate capable of suppressing a production cost to a low level and eliminating a dislocation from occurring on a substrate starting with a cracking even if an external force is applied to it from a side direction, wherein a linear bead part (24) is formed at a specified part of a metal plate (10) so as to provide a damping effect to the metal plate (10) by a cracking (26) caused in the bead part (24) and, in the steel plate (10) large in hardening capability, a linear hardened part (28) is formed at a specified part of the steel plate (10) so as to provide a damping effect to the steel plate (10) by a cracking (30) caused in the hardened part (28).

Inventors:
KAWAI TAKAO (JP)
Application Number:
PCT/JP1999/003877
Publication Date:
February 03, 2000
Filing Date:
July 19, 1999
Export Citation:
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Assignee:
KANEFUSA KNIFE & SAW (JP)
KAWAI TAKAO (JP)
International Classes:
B23D47/00; B23D61/02; B23K15/00; B23K26/352; B27B33/08; C22C38/22; C22C38/40; F16F15/00; F16F15/02; (IPC1-7): F16F15/02; B23D47/00; B27B33/08; C22C38/00
Foreign References:
JPS631501A1988-01-06
JPH07148612A1995-06-13
JPS52147510A1977-12-08
JPS57106488A1982-07-02
JPS52150321A1977-12-14
JPS54120352A1979-09-18
JPS5332806A1978-03-28
JPH0620562Y21994-06-01
JPH05316952A1993-12-03
Attorney, Agent or Firm:
Yamamoto, Yoshichika (Marunouchi 3-chome Naka-ku, Nagoya-shi Aichi, JP)
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