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Patent Searching and Data


Title:
DATA PROCESSING DEVICE, X-RAY DEVICE WITH SAME MOUNTED THEREIN, AND DATA PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/130530
Kind Code:
A1
Abstract:
According to the present invention, even when an object is substantially composed of two kinds of known materials A, B, the properties (bone density, bone quality, etc.) of the material A, which is one of the two materials and attracts attention, are obtained more accurately through simpler calculation. An X-ray image of the object, which is displayed on a monitor (38), is processed on the basis of photon counting data detected by a detector (25). On the X-ray image, in a direction of the path of the X-ray, an ROI (region of interest) is set in a portion in which the materials A (e.g. bone), B (e.g. "skin/muscle") are estimated to be present. An n-dimensional spatial vector (n is a positive integer of 2 or greater) of each of a plurality of pixels of the X-ray detector is calculated on the basis of the photon counting data, the spatial vectors corresponding to X-ray attenuation values in n respective energy regions of the X-ray when the X-ray passes through the object. The direction and magnitude of the spatial vector of each of the plurality of pixels are averaged and a representative vector, which represents the ROI, is calculated. An n-dimensional reference vector corresponding to the X-ray attenuation values of the material B is subtracted from an n-dimensional objective vector corresponding to X-ray attenuation values equivalent only to the material A.

Inventors:
YAMAKAWA TSUTOMU (JP)
YAMAMOTO SHUICHIRO (JP)
Application Number:
PCT/JP2020/046940
Publication Date:
June 23, 2022
Filing Date:
December 16, 2020
Export Citation:
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Assignee:
JOB CORP (JP)
International Classes:
A61B6/00
Domestic Patent References:
WO2016171186A12016-10-27
WO2020241669A12020-12-03
WO2003049615A12003-06-19
WO2018212217A12018-11-22
Foreign References:
JP2011250969A2011-12-15
JP2011024773A2011-02-10
Attorney, Agent or Firm:
SEIRYU Patent Professional Corporation et al. (JP)
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