Title:
DC BLOCK STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/228352
Kind Code:
A1
Abstract:
This DC block structure is constituted by: a dielectric (1); transfer lines (2a, 2b) that are formed on a surface of the dielectric (1) and that have characteristic impedances of 50 ohms; transfer lines (3a, 3b) that are so formed on the surface of the dielectric (1) as to connect to the transfer lines (2a, 2b) and that are so designed as to have characteristic impedances higher than those of the transfer lines (2a, 2b); and a capacitor (4) that is so mounted on the transfer lines (3a, 3b) as to series connect the transfer line (3a) to the transfer line (3b).
Inventors:
WAKITA HITOSHI (JP)
NAGATANI MUNEHIKO (JP)
JO TERUO (JP)
TAKEYA TSUTOMU (JP)
TAKAHASHI HIROYUKI (JP)
NAGATANI MUNEHIKO (JP)
JO TERUO (JP)
TAKEYA TSUTOMU (JP)
TAKAHASHI HIROYUKI (JP)
Application Number:
PCT/JP2022/021538
Publication Date:
November 30, 2023
Filing Date:
May 26, 2022
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE (JP)
International Classes:
H01P5/02
Foreign References:
| JPH02237301A | 1990-09-19 | |||
| JP2001196849A | 2001-07-19 |
Other References:
BUNEL C.; MURRAY F.: "Ultra thin low ESL and ultra wide broadband silicon capacitors", 2016 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING, 20 April 2016 (2016-04-20), pages 27 - 30, XP032909566, DOI: 10.1109/ICEP.2016.7486775
MULLER C.; BOUVIER S.; JATLAOUI M.: "Assembly Courtyard Improvement Using Silicon Capacitors: New Approaches for Signal and Power Integrity", 2019 IEEE 21ST ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), IEEE, 4 December 2019 (2019-12-04), pages 461 - 466, XP033731991, DOI: 10.1109/EPTC47984.2019.9026582
MULLER C.; BOUVIER S.; JATLAOUI M.: "Assembly Courtyard Improvement Using Silicon Capacitors: New Approaches for Signal and Power Integrity", 2019 IEEE 21ST ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), IEEE, 4 December 2019 (2019-12-04), pages 461 - 466, XP033731991, DOI: 10.1109/EPTC47984.2019.9026582
Attorney, Agent or Firm:
YAMAKAWA, Shigeki et al. (JP)
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