DC-DC CONVERTER IMPLEMENTED IN A LAND GRID ARRAY PACKAGE

Title:

DC-DC CONVERTER IMPLEMENTED IN A LAND GRID ARRAY PACKAGE

Document Type and Number:

WIPO Patent Application WO2004097905

Kind Code:

A3

Abstract:

A semiconductor chip package that includes a DC-DC converter implemented with a land grid array for interconnection and surface mounting to a printed circuit board. The package includes a two layer substrate (102) comprising a top surface (112) and a bottom surface. At least one via arrays (150, 152, 154, 156) extends through the substrate. Each via in a via array includes a first end that is proximate to the top surface of the substrate and a second end that is proximate to the bottom surface of the substrate. At least one die attach pad is mounted on the top surface of the substrate and is electrically and thermally coupled to the via array. The DC-DC converter includes at least one power semiconductor die (104) having a bottom surface that forms an electrode. The power semiconductor die is mounted on a die attach pad such that the bottom surface of the die is in electrical contact with the die attach pad. The bottom of the package forms a land grid array. The land grid array includes external pads that are separated into an interior region and a peripheral region. Each external pad located in the interior region of the land grid array is electrically and thermally coupled a via array.

Inventors:

DIVAKAR MYSORE PURUSHOTHAM (US)
KEATING DAVID (IE)
RUSSELL ANTOIN (IE)

Application Number:

PCT/US2004/009310

Publication Date:

June 02, 2005

Filing Date:

March 26, 2004

Export Citation:

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Assignee:

POWER ONE LTD (US)
DIVAKAR MYSORE PURUSHOTHAM (US)
KEATING DAVID (IE)
RUSSELL ANTOIN (IE)

International Classes:

H01L23/48; H01L23/367; H02M3/00; H02M3/158; (IPC1-7): H01L23/48; H01L29/40; H01L23/52

Foreign References:

US20020076851A1	2002-06-20
US6678168B2	2004-01-13

Other References: