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Title:
DECK PLATE FOR FLOOR SLAB, SLAB MODULE INTEGRATED WITH ONDOL PIPE, AND FLOOR SYSTEM INTEGRATED WITH ONDOL PIPE
Document Type and Number:
WIPO Patent Application WO/2013/051850
Kind Code:
A1
Abstract:
Disclosed are a deck plate for a floor slab, a slab module integrated with an ondol pipe, and a floor system integrated with an ondol pipe. The deck plate for a floor slab according to the present invention forms the floor slab of a building and includes a pipe installation groove configured to have an ondol pipe placed therein and iron reinforcing rods installed within the deck plate. The deck plate is made of concrete. In accordance with the present invention, since the deck plate that is previously fabricated using processes, such as concrete forming and curing, in an additional manufacturing plant is used to form the floor slab of a building, the construction time and the cost of construction can be substantially reduced because the concrete forming and curing processes need to be performed in a building construction site. Furthermore, since an ondol pipe has only to be disposed in a pipe installation groove already formed in the deck plate for the purpose of a heating construction in a construction site, the construction time and the cost of construction can be reduced because additional heating panel construction is omitted in a construction site.

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Inventors:
CHAE KYOUNG MYOUNG (KR)
BYUN YONG GEUN (KR)
KANG HEON SUNG (KR)
KANG SE CHANG (KR)
KIM JUN YUP (KR)
Application Number:
PCT/KR2012/008025
Publication Date:
April 11, 2013
Filing Date:
October 04, 2012
Export Citation:
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Assignee:
LG HAUSYS LTD (KR)
International Classes:
F24D3/12
Foreign References:
KR20010000459U2001-01-05
JP2002030796A2002-01-31
JP2004198009A2004-07-15
KR20050055671A2005-06-13
Other References:
See also references of EP 2780637A4
Attorney, Agent or Firm:
CHO, Inje (No. 301 3rd Fl., Buok Bldg. #648-18,,Yeoksam-dong, Gangnam-gu, Seoul 135-911, KR)
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