Title:
DECOUPLING STRUCTURE FOR ACCELEROMETER
Document Type and Number:
WIPO Patent Application WO/2018/122831
Kind Code:
A3
Abstract:
Accelerometer comprising a decoupling structure for fixing the accelerometer on a package by supporting a MEMS sensor chip for measuring an acceleration. The MEMS sensor chip comprises a first sensor wafer layer of a semiconductor material. The decoupling structure forms a bottom portion for fixing the decoupling structure on the package and a top portion fixed to the first sensor wafer layer. A width of the top portion in a first planar direction is smaller than a width of the bottom portion. The decoupling structure is made out of the same semiconductor material as the first sensor wafer layer. The top and the bottom portion are manufactured from the same wafer layer. The centre point of the top portion in the first planar direction is arranged in a central region of the bottom portion. The MEMS sensor chip comprises a hermetically closed cavity which includes a seismic mass of the MEMS sensor chip.
Inventors:
GONSETH STEPHAN (CH)
BRISSON RAPHAËL (CH)
MOSER JACQUES (CH)
BRISSON RAPHAËL (CH)
MOSER JACQUES (CH)
Application Number:
PCT/IB2018/053144
Publication Date:
October 25, 2018
Filing Date:
May 07, 2018
Export Citation:
Assignee:
SAFRAN COLIBRYS SA (CH)
International Classes:
G01P1/00; B81B7/00; G01P15/08; G01P1/02
Domestic Patent References:
| WO2011016859A2 | 2011-02-10 |
Foreign References:
| US20010047688A1 | 2001-12-06 | |||
| US20150128703A1 | 2015-05-14 | |||
| US20170107098A1 | 2017-04-20 |
Attorney, Agent or Firm:
P&TS SA (AG, LTD.) (CH)
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