Title:
DEFECT DETECTION DEVICE, DEFECT DETECTION METHOD, WAFER, SEMICONDUCTOR CHIP, DIE BONDER, SEMICONDUCTOR MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/225664
Kind Code:
A1
Abstract:
A defect detection device for detecting a defect comprising at least an inclined surface portion in a work as a part of a semiconductor product or a semiconductor product is provided with an inspection mechanism comprising: an illuminating means which irradiates the work with bright-field illumination light; and an image capture device which configures an observation optical system and with which an observation portion of the work irradiated by the illuminate means is observed. The inspection mechanism observes reflected light from the work that has exited from an out-of-focus position defocused from an in-focus position in an optical axis direction, and emphasizes a defect on an observed image formed by means of reflected light from the out-of-focus position, compared with a defect on an observed image formed by means of reflected light from the in-focus position.
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Inventors:
TAI HARUKA (JP)
NAGAMOTO NOBUHIRO (JP)
SHIMOKAWA YOSHIKAZU (JP)
SHIMIZU YOJI (JP)
KAMBAYASHI ATSUMASA (JP)
NAGAMOTO NOBUHIRO (JP)
SHIMOKAWA YOSHIKAZU (JP)
SHIMIZU YOJI (JP)
KAMBAYASHI ATSUMASA (JP)
Application Number:
PCT/JP2018/021298
Publication Date:
December 13, 2018
Filing Date:
June 01, 2018
Export Citation:
Assignee:
CANON MACHINERY INC (JP)
International Classes:
H01L21/52; G01N21/956; H01L21/66
Foreign References:
| JP2009074825A | 2009-04-09 | |||
| JP2008008740A | 2008-01-17 | |||
| JP2014013802A | 2014-01-23 | |||
| JP2007115870A | 2007-05-10 | |||
| JP2001150255A | 2001-06-05 |
Attorney, Agent or Firm:
SHIROMURA Kunihiko et al. (JP)
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