Title:
DEFECT GRINDING METHOD FOR ROUND STEEL AND MANUFACTURING METHOD FOR STEEL
Document Type and Number:
WIPO Patent Application WO/2020/111246
Kind Code:
A1
Abstract:
The present invention provides a defect grinding method for round steel by which a defect portion of round steel can be automatically ground without causing such error grinding that a position of the defect portion and a grinding position are misaligned, and a manufacturing method for steel. A defect grinding method for round steel is provided with: a marking step (Step S2) for coating, with a marking M, a defect portion having a predetermined depth or more, which has been subjected to flaw detection in a flaw detection step (Step S1); a defect portion map creation step (Step S3) for creating a defect portion map (50) from a flaw detection result in the flaw detection step; and a defect portion grinding step (Step S4) for grinding the defect portion. In a marking spot grinding step (Step S47) in the defect portion grinding step, grinding positioning of a round steel S in a longitudinal direction is decided by referring to the defect portion map (50). Grinding positioning of the round steep S in a circumferential direction is decided by referring to an extraction result for the marking (M) by the marking detection step (Step S46). A grinding depth is decided by checking the defect portion map (50) and the extraction result for the marking (M).
Inventors:
SATO KYOSUKE (JP)
TANAKA MIKIO (JP)
TANAKA YUTO (JP)
MATSUMOTO MINORU (JP)
TANAKA MIKIO (JP)
TANAKA YUTO (JP)
MATSUMOTO MINORU (JP)
Application Number:
PCT/JP2019/046840
Publication Date:
June 04, 2020
Filing Date:
November 29, 2019
Export Citation:
Assignee:
JFE STEEL CORP (JP)
International Classes:
B21C51/00; B21C37/04; B23Q17/24; B24B27/033; G01B11/00
Foreign References:
JP2000141198A | 2000-05-23 | |||
JP2000117612A | 2000-04-25 | |||
JPH11320378A | 1999-11-24 | |||
JP2018036139A | 2018-03-08 | |||
JPS62255062A | 1987-11-06 | |||
US20040073401A1 | 2004-04-15 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
Download PDF: