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Patent Searching and Data


Title:
DEFORMATION MEASURING METHOD AND DEVICE, AND SHEET PROCESSING METHOD AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/109008
Kind Code:
A1
Abstract:
A deformation measuring method and device and a sheet processing method and device capable of simple and accurate measurement of the amount of deformation in a sheet and further capable of sheet deformation processing are provided. This deformation measuring device, which measures the amount of deformation in an object to be measured that is a sheet whereon a plurality of patterns are inscribed, is characterized by comprising: a camera holding case in which a plurality of cameras to photograph the surface of the sheet object to be measured are fixedly disposed; a camera holding case moving means for moving the camera holding case on a plane parallel to the surface of the sheet object to be measured; a camera holding case position control means for controlling the position of the camera holding case moving means on a plane parallel to the surface of the sheet object to be measured; and a deformation shape analyzing means for calculating the amount of deformation of the sheet object to be measured using information on the position determined by the camera holding case position control means and imaging information photographed by the cameras.

Inventors:
YAMAZAKI KATSUMASA (JP)
MIYASAKA TOORU (JP)
MITSUYAMA TOSHIFUMI (JP)
TAMAMOTO JUNICHI (JP)
Application Number:
PCT/JP2013/050164
Publication Date:
July 17, 2014
Filing Date:
January 09, 2013
Export Citation:
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Assignee:
HITACHI LTD (JP)
International Classes:
G01B11/16
Foreign References:
JP2002342745A2002-11-29
JP2000258132A2000-09-22
JP2012240786A2012-12-10
JP2010101878A2010-05-06
Attorney, Agent or Firm:
POLAIRE I. P. C. (JP)
Polaire Intellectual Property Corporation (JP)
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