Title:
DEGRADABLE RESIN COMPOSITION, AND PREPREG AND LAMINATE PREPARED USING SAME AND RECYCLING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2018/120588
Kind Code:
A1
Abstract:
The present invention relates to a low-dielectric, highly-heat-resistant, and degradable resin composition, and a prepreg and a laminate prepared using the same and a recycling method thereof. The resin composition comprises an epoxy resin, a degradable curing agent, and a non-degradable curing agent. The molar ratio of reactive groups of the degradable curing agent and the non-degradable curing agent is (0.15-3):1. The present invention can significantly improve the heat resistance of the resin composition by adding a non-degradable curing agent in addition to a degradable curing agent. Furthermore, the present invention overcomes a technical prejudice by adding a non-degradable curing agent to a degradable curing agent system for co-curing of epoxy, and can still realize the recyclable degradation of a copper-clad plate based laminate and printed circuit board.
Inventors:
JIE XINGDI (CN)
LIN WEI (CN)
YANG ZHONGQIANG (CN)
XU YONGJING (CN)
LIN WEI (CN)
YANG ZHONGQIANG (CN)
XU YONGJING (CN)
Application Number:
PCT/CN2017/084316
Publication Date:
July 05, 2018
Filing Date:
May 15, 2017
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08G59/40; B32B15/14; B32B15/20; C08G59/50; C08J5/24; C08J11/00; C08J11/08; H05K1/03
Domestic Patent References:
WO2016177307A1 | 2016-11-10 |
Foreign References:
CN103254406A | 2013-08-21 | |||
CN103694140A | 2014-04-02 | |||
CN103012747A | 2013-04-03 | |||
CN1483754A | 2004-03-24 | |||
CN103249712A | 2013-08-14 | |||
US20150094400A1 | 2015-04-02 |
Other References:
See also references of EP 3564288A4
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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