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Patent Searching and Data


Title:
DEMOLDING DEVICE, DEMOLDING METHOD, AND IMPRINTING DEVICE USING SAID DEMOLDING DEVICE AND DEMOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/096076
Kind Code:
A1
Abstract:
Provided is a demolding device capable of easily demolding a die and an object to be formed in a short period of time using limited space even when the object formation area becomes large. Also provided are a demolding method, and an imprinting device using the aforementioned demolding device and demolding method. A demolding device for demolding a die (100) and an object to be formed (200) which are attached to one another, the demolding device being provided with a separation means (1) for forming a gap (150) between the edge of the object to be formed (200) and the die (100), and a fluid spraying means (2) for spraying a fluid to the gap (150) located between the die (100) and the object to be formed (200) and formed by means of the separation means (1). The demolding force of the fluid directly acts on the attachment part.

Inventors:
KAWAGUCHI HIROSUKE (JP)
TANAKA SATORU (JP)
Application Number:
PCT/JP2011/078063
Publication Date:
July 19, 2012
Filing Date:
December 05, 2011
Export Citation:
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Assignee:
SCIVAX CORP (JP)
KAWAGUCHI HIROSUKE (JP)
TANAKA SATORU (JP)
International Classes:
B29C33/44; B29C59/02
Foreign References:
JP2008254353A2008-10-23
JP2006035547A2006-02-09
JP2009214485A2009-09-24
JP2002509499A2002-03-26
JPS57187717U1982-11-29
JPH06134774A1994-05-17
JPH02166645A1990-06-27
JPH11144334A1999-05-28
Attorney, Agent or Firm:
OKUDA Noritsugu (JP)
Okuda 律次 (JP)
Download PDF:
Claims: