Title:
DEMOLDING FILM
Document Type and Number:
WIPO Patent Application WO/2017/200103
Kind Code:
A1
Abstract:
A demolding film comprising: a support comprising a substrate and an adhesive layer disposed upon the substrate; and an electromagnetic wave-shielding sheet disposed upon the adhesive layer of the support. The peel strength between the adhesive layer and the electromagnetic wave-shielding sheet is 0.10 N/50 mm to 2.00 N/50 mm.
Inventors:
ISHIJIMA HIDEAKI (JP)
YANAGITA YUUKI (JP)
YANAGITA YUUKI (JP)
Application Number:
PCT/JP2017/018931
Publication Date:
November 23, 2017
Filing Date:
May 19, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B32B27/00; C09J7/20; C09J133/00; C09J183/04; C09J201/00; H01L21/56; H01L23/00; H01L23/28
Domestic Patent References:
| WO2013183671A1 | 2013-12-12 | |||
| WO2008093414A1 | 2008-08-07 | |||
| WO2014148642A1 | 2014-09-25 |
Foreign References:
| JPH0817855A | 1996-01-19 | |||
| JPH08288686A | 1996-11-01 | |||
| JP2013021270A | 2013-01-31 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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