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Patent Searching and Data

Document Type and Number:
WIPO Patent Application WO/2018/030236
Kind Code:
Provided is a method for efficiently removing deposits including hard deposits adhered to a jig in a film-forming process using crystal growth while suppressing the damage to the jig. This deposit removing method includes: a step of preparing a spray material having a lower hardness than the jig; a step of spraying the spray material toward the jig; and a step of forming a breaking start point at a crystal grain boundary of the deposit when the spray material collides with the jig, and detaching the deposit from the crystal grain boundary by allowing the spray material to further collide with the jig.

NISHIJIMA Hitoshi (Oharu-Jigyosho, 71-2, Aza-Tukeda, Oaza-Nishijo, Oharu-cho, Ama-gu, Aichi 44, 〒4901144, JP)
SHIBUYA Norihito (Oharu-Jigyosho, 71-2, Aza-Tukeda, Oaza-Nishijo, Oharu-cho, Ama-gu, Aichi 44, 〒4901144, JP)
Application Number:
Publication Date:
February 15, 2018
Filing Date:
August 02, 2017
Export Citation:
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SINTOKOGIO, LTD. (28-12, Meieki 3-chome Nakamura-ku, Nagoya-sh, Aichi 24, 〒4506424, JP)
International Classes:
H01L21/31; B24C1/08; B24C11/00; C23C16/44
Attorney, Agent or Firm:
TANAKA Shinichiro et al. (NAKAMURA & PARTNERS, Shin-Tokyo Bldg. 3-1, Marunouchi 3-chome, Chiyoda-k, Tokyo 55, 〒1008355, JP)
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