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Patent Searching and Data


Title:
DEPOSITION AND PATTERNING PROCESS
Document Type and Number:
WIPO Patent Application WO2005033352
Kind Code:
A3
Abstract:
A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means. A method for applying metal particles such as solder metal in a pattern to an electronic device substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means.

Inventors:
LEWIS BRIAN G (US)
SINGH BAWA (US)
DETIG ROBERT H (US)
MINOGUE GERARD (US)
EBERLEIN DIETMAR C (US)
REILLY KENNETH (US)
MARCZI MICHAEL (US)
Application Number:
US2004022143W
Publication Date:
July 14, 2005
Filing Date:
July 09, 2004
Export Citation:
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Assignee:
FRY'S METALS INC.
LEWIS, BRIAN, G.
SINGH, BAWA
DETIG, ROBERT, H.
MINOGUE, GERARD
EBERLEIN, DIETMAR, C.
REILLY, KENNETH
MARCZI, MICHAEL
International Classes:
B01J19/08; B05D1/06; B05D1/32; B23K3/06; H01L21/288; H01L21/48; H01L21/60; H05K3/34; C23C; (IPC1-7): B05D1/06
Foreign References:
US5071517A1991-12-10
US6027630A2000-02-22
US6780249B22004-08-24
US6790483B22004-09-14
Other References:
See also references of EP 1663513A4
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