MATERIAL ON A SUBSTRATE

TECHNICAL FIELD

[0001] The present disclosure relates to deposition sources configured for depositing an evaporated material, particularly an evaporated organic material, on one or more substrates. More specifically, deposition sources with a plurality of nozzles for directing plumes of evaporated material toward a substrate are described. Embodiments of the present disclosure particularly relate to a deposition source for depositing an evaporated material on a substrate, a deposition apparatus with at least one deposition source and methods for depositing an evaporated material on one or more substrates.

BACKGROUND

[0002] Organic evaporators are a tool for the production of organic light-emitting diodes (OLED). OLEDs are a special type of light-emitting diode in which the emissive layer comprises a thin-film of certain organic compounds. Organic light emitting diodes (OLEDs) are used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, e.g. for displaying information. OLEDs can also be used for general space illumination. The range of colors, brightness, and viewing angles of OLED displays may be greater than that of traditional LCD displays because OLED pixels directly emit light and do not involve a back light. Therefore, the energy consumption of OLED displays is considerably less than that of traditional LCD displays. Further, the fact that OLEDs can be manufactured onto flexible substrates results in further applications.

[0003] Typically, the evaporated material is directed toward the substrate by a plurality of nozzles which may provide outlets in a distribution pipe. A careful design of these nozzles is beneficial in order to obtain predetermined layer characteristics such as a predetermined uniformity, thickness and shape of a pattern of evaporated material on the substrate. Further, the plumes of evaporated material which emanate from the nozzle outlets should be formed such that most of the evaporated material reaches the surface of the substrate and the chamber wall is not contaminated. A condensation of a portion of the evaporated material on an inner surface of the vacuum chamber should be avoided, in order to save material and in order to reduce the cleaning efforts. It may be reasonable to provide evaporation shields adjacent to the substrate, in order to avoid a contamination of the walls of the vacuum chamber with evaporated material.

[0004] Accordingly, it would be beneficial to reduce the material consumption of an evaporation source and to decrease the cleaning efforts of a deposition apparatus.

SUMMARY

[0005] In view of the above, a deposition source, a deposition apparatus as well as a method of depositing evaporated material on a substrate according to the independent claims are provided. Further advantages, features, aspects and details are apparent from the dependent claims, the description and drawings.

[0006] According to one aspect of the present disclosure, a deposition source for depositing evaporated material on a substrate is provided. The deposition source includes a distribution pipe assembly with a plurality of nozzles configured for directing evaporated material toward a substrate, wherein at least one nozzle of the plurality of nozzles is provided with a closing mechanism configured for opening and closing the at least one nozzle.

[0007] In some embodiments, each nozzle of the plurality of nozzles may be provided with a respective closing mechanism for opening and closing the nozzle.

[0008] According to another aspect of the present disclosure, a deposition apparatus for depositing evaporated material on two or more substrates is provided. The deposition apparatus includes a vacuum chamber, wherein a first deposition area for arranging a substrate and a second deposition area for arranging a second substrate are provided in the vacuum chamber; and a deposition source which is configured to move sequentially past the first deposition area and past the second deposition area. The deposition source includes a distribution pipe assembly with a plurality of nozzles configured for directing evaporated material toward a substrate, wherein at least one nozzle of the plurality of nozzles is provided with a closing mechanism configured for opening and closing the at least one nozzle. [0009] According to a further aspect of the present disclosure, a method of depositing evaporated material on a substrate is provided. The method includes providing a deposition source comprising a distribution pipe assembly with a plurality of nozzles and a plurality of closing mechanisms, wherein each closing mechanism is configured for opening and closing an associated nozzle of the plurality of nozzles; directing evaporated material from the plurality of nozzles toward the substrate; and closing the plurality of nozzles with the plurality of closing mechanisms.

[0010] The disclosure is also directed to an apparatus for carrying out the disclosed methods including apparatus parts for performing the methods. The method may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, the disclosure is also directed to operating methods of the described apparatus. The disclosure includes a method for carrying out every function of the apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] So that the manner in which the above recited features of the disclosure described herein can be understood in detail, a more particular description, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:

[0012] FIG. 1A shows a schematic sectional view of a section of a deposition source for depositing evaporated material on a substrate according to embodiments described herein, wherein the nozzles are in an open state;

[0013] FIG. IB shows a schematic sectional view of the deposition source of FIG. 1 A, wherein the nozzles are in a closed state;

[0014] FIG. 2A shows a schematic sectional view of a deposition source for depositing evaporated material on a substrate according to embodiments described herein, wherein the nozzles are in a closed state;

[0015] FIG. 2B shows a schematic sectional view of the deposition source of FIG. 2A, wherein the nozzles are in an open state; [0016] FIG. 2C shows a schematic sectional view of the deposition source of FIG. 2A, wherein the nozzles are in an open state;

[0017] FIG. 3 shows a schematic top view of a deposition apparatus according to embodiments described herein;

[0018] FIG. 4 shows a schematic sectional view of a deposition source according to embodiments described herein;

[0019] FIG. 5 shows a schematic sectional view of a deposition source according to embodiments described herein;

[0020] FIG. 6 shows a schematic sectional view of a deposition source according to embodiments described herein;

[0021] FIG. 7 shows a flow diagram illustrating a method of depositing an evaporated material on a substrate according to embodiments described herein; and

[0022] FIG. 8 shows a flow diagram illustrating a method of depositing an evaporated material on a substrate according to embodiments described herein.

DETAILED DESCRIPTION OF EMBODIMENTS

[0023] Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. In the following, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation of the disclosure. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0024] FIG. 1A and FIG. IB show schematic sectional views of a deposition source

100 for depositing evaporated material on a substrate 10 according to some embodiments described herein. The deposition source 100 includes a distribution pipe assembly 120 with at least one distribution pipe, wherein a front wall 128 of the at least one distribution pipe is shown in FIG. 1A and in FIG. IB in a sectional view. The front wall 128 of the distribution pipe may be directed toward the substrate 10.

[0025] The distribution pipe assembly 120 includes a plurality of nozzles 130 which are configured for directing the evaporated material 15 toward the substrate 10. Two nozzles of the plurality of nozzles 130 are depicted in FIG. 1A. The nozzles may provide outlets on a front side of the distribution pipe so that the evaporated material may exit from an interior of the distribution pipe through the plurality of nozzles 130 of the distribution pipe and may propagate toward the substrate 10. The substrate 10 may be arranged in front of the distribution pipe assembly 120, e.g., facing toward the front wall 128.

[0026] At least one nozzle 131 of the plurality of nozzles 130 is provided with a closing mechanism 151 configured for opening and closing the at least one nozzle 131.

[0027] In the present disclosure, a "closing mechanism" may be understood as a mechanism which is configured for closing and opening one associated nozzle of the plurality of nozzles. The closing mechanism may be configured for switching between an open state and a closed state of the associated nozzle. In the open state, evaporated material may propagate through an outlet of the associated nozzle from an interior of the distribution pipe assembly to an exterior of the distribution pipe assembly. In the closed state, the outlet of the associated nozzle may be closed so that essentially no evaporated material can propagate from the interior of the distribution pipe assembly through the outlet of the nozzle to the exterior of the distribution pipe assembly.

[0028] For example, the closing mechanism 151 may be configured for selectively opening or closing the at least one nozzle 131, e.g. independent from the other nozzles of the plurality of nozzles. For example, the closing mechanism 151 may be configured for opening or closing the at least one nozzle 131 together with other nozzles of the plurality of nozzles 130.

[0029] By providing a closing mechanism for the at least one nozzle 131 as described herein, the at least one nozzle 131 can be closed in a quick and efficient manner. For example, the at least one nozzle 131 can be closed in a time interval between the deposition on a first substrate and a subsequent deposition on a second substrate. For example, the at least one nozzle can be closed during a time interval that is used for moving the deposition source from a first substrate toward a second substrate that is to be coated thereafter. Further, the at least one nozzle can be closed for servicing, maintenance, cleaning, during idle times and/or under particular circumstances during substrate processing.

[0030] In some time intervals during substrate processing, no substrate may be arranged in front of the at least one nozzle 131 so that material can be saved by closing the at least one nozzle via the closing mechanism during such time intervals. Further, the condensation of evaporated material on an inner wall of a vacuum chamber can be reduced or avoided by closing the at least one nozzle in certain time intervals. The cleaning of the vacuum chamber and/or of shields provided in the vacuum chamber for shielding certain chamber areas may be simplified. In the closed state of the at least one nozzle 131, the evaporated material 15 may be maintained in a heated state within the distribution pipe assembly 120 so that the evaporated material can later be used for the deposition on a substrate. When a substrate is arranged in front of the at least one nozzle 131 and the distribution pipe assembly 120 is ready for deposition, the at least one nozzle 131 may be switched from the closed state II to the open state I so that the evaporated material 15 may propagate toward the substrate through the outlet of the at least one nozzle 131.

[0031] By closing the at least one nozzle 131 at certain time intervals, the amount of evaporated material may be reduced to the actual amount needed for deposition. Accordingly, embodiments of the deposition source described herein may provide for high quality deposition on substrates. Additionally, by providing a closable nozzle, particle generation of evaporated material may be reduced which can be beneficial.

[0032] In some embodiments, which can be combined with other embodiments described herein, two or more nozzles of the plurality of nozzles may be provided with a respective closing mechanism configured for opening and closing the two or more nozzles. More particularly, each nozzle of the plurality of nozzles may be provided with a respective closing mechanism configured for opening and closing an associated nozzle of the plurality of nozzles. In particular, the distribution pipe assembly may include a plurality of closing mechanisms, wherein each closing mechanism may be configured for opening and closing an associated nozzle of the plurality of nozzles. The number of closing mechanisms may correspond to the number of nozzles so that each nozzle of the plurality of nozzles may be opened or closed as appropriate.

[0033] In some embodiments, the closing mechanisms may be operated individually so that each nozzle of the plurality of nozzles can be selectively opened or closed. In some embodiments, the closing mechanisms of a subset of the plurality of nozzles may be operated together, e.g. synchronously, so that a subset of nozzles can be opened or closed in synchrony and/or under predetermined conditions. In some embodiments, all nozzles of the plurality of nozzles can be opened or closed synchronously via the plurality of closing mechanisms which may be controllable by a common controller unit.

[0034] When all nozzles of the plurality of nozzles are closed, the evaporated material can be enclosed by heated side walls of distribution pipes of the distribution pipe assembly. When some or all nozzles are opened, the evaporated material can be directed toward one or more substrates through the plurality of nozzles.

[0035] In FIG. 1A, the plurality of nozzles 130 is in an open state. In FIG. IB, the plurality of nozzles 130 is in a closed state. As is exemplarily shown in FIG. IB, in the closed state of the at least one nozzle 131, a closing element 152 may be at a position within the at least one nozzle 131 at which the at least one nozzle 131 is blocked by the closing element 152. The closing element 152 and the at least one nozzle 131 may be configured such that the at least one nozzle 131 can be sealed by the closing element 152. Accordingly, a channel 132 of the at least one nozzle 131 may be blocked in the closed state of the at least one nozzle.

[0036] In the following, the closing mechanism 151 of the at least one nozzle 131 will be described in more detail. However, it is to be understood that two or more nozzles of the plurality of nozzles or all nozzles may be provided with a closing mechanism having a similar or a corresponding setup.

[0037] In some embodiments, which may be combined with other embodiments described herein, the closing mechanism 151 is a magnetic closing mechanism configured for opening and closing the at least one nozzle 131 by applying a magnetic force. For example, a closing element 152 may be configured for blocking the channel 132 of the at least one nozzle, when a magnetic force pulls the closing element in the closed state II. Alternatively or additionally, the closing element 152 may be configured for opening the channel of the at least one nozzle 131, when a magnetic force pulls the closing element in the open state I.

[0038] In the present disclosure, a "magnetic closing mechanism" may be understood as a mechanism which is configured for closing and opening a nozzle, wherein a magnetic force is employed for closing and opening the nozzle.

[0039] In some embodiments, the closing mechanism 151 may include a closing element 152 configured to be moved between the open state I and the closed state II. In the open state I, an outlet of the at least one nozzle may be open so that evaporated material may exit from the interior of the distribution pipe assembly toward the substrate. In the closed state II, the outlet of the at least one nozzle may be partially or entirely blocked by the closing element so that the evaporated material cannot leave the interior of the distribution pipe assembly through the at least one nozzle. When the closing element 152 blocks the nozzle outlet of the at least one nozzle in the closed state II, the evaporated material may remain in the heated distribution pipe assembly and cannot not form a condensate on a cold external surface. Accordingly, the consumption of evaporated material is reduced.

[0040] The at least one nozzle 131 may include a channel 132, wherein, in the closed state II, the closing element 152 may be arranged at least partially within the channel 132 for blocking the channel 132. In the open state I, the closing element 152 may be removed partially or entirely from the channel 132 so that the evaporated material can stream through the channel 132 toward the substrate without being blocked by the closing element 152.

[0041] The closing mechanism 151 may be a magnetic closing mechanism and the closing element may include at least one magnetic material selected from the group consisting of: Ferromagnetic materials, particularly iron, nickel, cobalt, rare metal alloys and ferromagnetic alloys. [0042] According to embodiments which can be combined with other embodiments described herein, the closing mechanism 151 may include an electromagnetic arrangement 154, as is exemplarily shown in FIG. 1A and in FIG. IB. The electromagnetic arrangement 154 is configured for exerting a magnetic force on the closing element 152 for moving the closing element 152 from the open state I into the closed state II of the at least one nozzle 131 and/or vice versa. As is exemplarily shown in FIG. IB, the electromagnetic arrangement 154 may be arranged around the channel 132 of the at least one nozzle and may include a permanent magnet or an electromagnet, e.g. including a coil or a winding.

[0043] According to embodiments, which can be combined with other embodiments described herein, a holding element 156 may be provided for holding the closing element 152 in an open position. With exemplary reference to FIG. 1A, the holding element 156 may be an elastic element, such as a spring. The holding element 156 may be connected to the closing element 152. The holding element 156 may be connected to a wall of the distribution pipe assembly 120. Accordingly, in the case that the electromagnetic arrangement 154 is switched on to exert a magnetic force on the closing element 152, the closing element may move towards the electromagnetic arrangement 154 resulting in a closure or an opening of the at least one nozzle 131, as is exemplarily shown in FIG. IB. From FIG. 1A and FIG. IB the skilled person understands that when the electromagnetic arrangement 154 is switched off, the holding element 156 may exert a force on the closing element 152 such that the closing element 152 moves back to the initial position, for example in the open position as shown in FIG. 1 A or alternatively in the closed position. In particular, the holding element 156 may exert an elastic force on the closing element 152, for example a spring force stored in the elastic holding element in a closed state, as exemplarily shown in FIG. IB.

[0044] According to embodiments, which can be combined with other embodiments described herein, the closing element 152 can be in the form of a variety of geometric shapes. In particular, the closing element may include an aerodynamic, laminar- promoting, and or turbulence reducing shape. For example, the closing element 152 may have a spherical-like shape, which is configured for sealing the at least one nozzle in a closed state, as exemplarily shown in FIG. IB. Alternatively, the closing element may include an ellipsoidal shape, a cone-like shape, a double cone-like shape, a pyramidal shape, a diamond-like shape or any other suitable shape. It is to be understood that according to embodiments described herein, the geometry of the closing element and the geometry of the nozzle may be adapted to each other, such that the at least one nozzle 131 may be sealed in a closed position of the closing element.

[0045] According to embodiments which can be combined with other embodiments described herein, the electromagnetic arrangement 154 may be connected to a power source. The power source can include a variable voltage source, such as a DC power source, an AC power source, or the like. For example, when the electromagnetic arrangement is energized by the power source, the electromagnetic arrangement may magnetically bias the closing element such that the closing element resultantly moves towards the position or away from the position at which the energized electromagnetic arrangement is arranged. A movement of the closing element is exemplarily indicated in FIG. 1 A by an arrow on the closing element.

[0046] According to embodiments, which can be combined with other embodiments described herein, the electromagnetic arrangement 154 may be configured as a ring magnet arranged around the at least one nozzle 131, as exemplarily shown in FIG. 1A and FIG. IB. Alternatively, the electromagnet arrangement 154 may include one or more electromagnetic elements which may be arranged around the at least one nozzle. The one or more electromagnetic elements can be connected to the power source for energizing the one or more electromagnetic elements.

[0047] According to embodiments which can be combined with other embodiments described herein, the closing element 152 may be coated with a coating material. The coating material may be non-reactive with respect to the evaporated material 15. In particular, the coating may include a material which is non-reactive with respect to evaporated organic material. For example, the coating may include at least one material selected from the group consisting of titanium (Ti), ceramics, particularly silicon oxide (Si02), aluminum oxide (A1203), magnesium oxide (MgO) and zirconium oxide (Zr02). Accordingly, accumulation of evaporated material on the closing element may be reduced or even avoided.

[0048] In some embodiments, the closing element 152 may be made of a material that is non-reactive with respect to the evaporated material 15, e.g. one of the above mentioned materials. For example, an inner wall of the distribution pipe assembly and the closing element 152 may include the same material or may be made of the same material.

[0049] According to embodiments which can be combined with other embodiments described herein, an inner wall of the channel 132 of the at least one nozzle 131 may be configured to have an aerodynamic and/or laminar-promoting and/or turbulence reducing geometry.

[0050] The inner wall of the channel 132 may include a surface coating. The surface coating may include a material which is non-reactive with respect to the evaporated material, particularly non-reactive with respect to an evaporated organic material. For example, the surface coating may include at least one material selected from the group consisting of titanium (Ti), ceramics, particularly silicon oxide (Si02), aluminum oxide (A1203), magnesium oxide (MgO) and zirconium oxide (Zr02). Accordingly, accumulation of evaporated material on the inner wall of the channel 132 may be reduced, which may be beneficial in order to avoid clogging of the at least one nozzle 131.

[0051] According to embodiments which can be combined with other embodiments described herein, the closing mechanism may include a control system. The control system may be connected to the electromagnetic arrangements 154 of one of more nozzles. The control system may be connected to a power source for energizing the electromagnetic arrangements. In particular, the control system may control the power of a power source employed for energizing one or more electromagnetic arrangements. For example, the control system may be configured to control a plurality of closing mechanisms for opening and closing the plurality of nozzles. Accordingly, by controlling the power of the power source, a magnetic force generated by the electromagnetic arrangements may be adjusted which may be beneficial for controlling the switching time from the closed state II to the open state I of the plurality of nozzles and vice versa.

[0052] FIG. 2A shows a schematic sectional view of a deposition source 200 for depositing an evaporated material 15 on a substrate 10 according to embodiments described herein. The distribution pipe assembly 120 of the deposition source 200 has a plurality of nozzles 130 configured for directing plumes of evaporated material toward a substrate 10, wherein the plurality of nozzles 130 is in a closed state II. For example, the nozzle channels of the plurality of nozzles 130 may be blocked by respective closing elements so that no evaporated material can leave an interior of the distribution pipe assembly 120 and propagate toward the substrate 10.

[0053] FIG. 2B shows a schematic sectional view of the deposition source 200 of FIG. 2A, wherein the plurality of nozzles 130 is in an open state I. Evaporated material 15 is directed by the plurality of nozzles 130 toward the substrate 10 for coating the substrate with a material layer, e.g. with a layer including an organic material. The plurality of nozzles is directed to the left side in FIG. 2B.

[0054] FIG. 2C shows a schematic sectional view of the deposition source 200 of FIG. 2A, wherein the plurality of nozzles 130 is in an open state I. Evaporated material 15 is directed by the plurality of nozzles 130 toward a second substrate 11 for coating the second substrate with a material layer, e.g. with a layer including an organic material. The second substrate 11 may be arranged on a second side of the deposition source 20 as compared to the substrate 10 of FIG. 2B, e.g. on the opposite side. The plurality of nozzles 130 is directed to the right side in FIG. 2C. For example, the distribution pipe assembly 120 was turned by about 180°.

[0055] The nozzles, the closing mechanisms and the deposition source of FIGS. 2 A, 2B and 2C may be similar to the nozzles, the closing mechanisms and the deposition source of FIGS. 1A and IB so that reference can be made to the above explanations which are not repeated here.

[0056] Each nozzle of the plurality of nozzles 130 may be provided with a respective closing mechanism for opening and closing the associated nozzle. Accordingly, a plurality of closing mechanisms 150 may be provided, wherein the number of closing mechanisms may correspond to the number of the plurality of nozzles 130. Each of the plurality of closing mechanisms 150 may be configured in accordance with the closing mechanism 151 described above so that reference can be made to the above explanations which are not repeated here. [0057] In some embodiments, which can be combined with other embodiments described herein, the deposition source 200 includes one or more evaporation crucibles 122 configured to evaporate a material, wherein each of the one or more evaporation crucibles 122 is in fluid communication with a distribution pipe 121 of the distribution pipe assembly 120. For example, the distribution pipe assembly 120 may include three evaporation crucibles 122 and three distribution pipes 121, wherein each evaporation crucible may be in fluid connection with one distribution pipe. Only one distribution pipe 121 is shown in the sectional views of FIGS. 2A, 2B, and 2C.

[0058] In some embodiments, the distribution pipe 121 of the distribution pipe assembly 120 may extend in a length direction which may be an essentially vertical direction V. A plurality of nozzles 130 may be provided along the length of the distribution pipe 121, i.e. in a linear array. For example, a plurality of nozzles may be provided along the length of the distribution pipe 121 at an equal spacing. For example, the distance between two adjacent nozzles in the length direction of the distribution pipe 121 may be 5 cm or less, particularly 4 cm or less. The distribution pipe 121 may include ten or more nozzles, particularly thirty or more nozzles which may be arranged in a linear array.

[0059] If the distribution pipe assembly 120 includes two or more distribution pipes, the two or more distribution pipes may be arranged essentially parallel to each other in a length direction which may be a vertical direction V. Each distribution pipe may include two or more nozzles, particularly ten or more nozzles, more particularly thirty or more nozzles arranged along the length of the distribution pipe, e.g. in a linear array. The distribution pipes may be configured for directing different materials (e.g. at least one host and at least one dopant) toward the substrate.

[0060] In some embodiments, which may be combined with other embodiments described herein, the distribution pipe assembly 120 includes two, three or more distribution pipes 121 extending in an essentially vertical direction V, wherein each of the two or more distribution pipes is provided with nozzles arranged in a length direction of the two or more distribution pipes 121. The nozzles of the two or more distribution pipes 121 may be directed in the same direction and may form the plurality of nozzles 130. [0061] In some embodiments, each nozzle of the plurality of nozzles 130 may be provided with a closing mechanism configured for opening and closing the respective nozzle.

[0062] As is schematically depicted in FIG. 2A, the plurality of nozzles 130 can be closed with the plurality of closing mechanisms 150, in order to prevent evaporated material from leaving the distribution pipe 121 toward a first deposition area 201. For example, the plurality of nozzles 130 can be closed, when no substrate is arranged in front of the distribution pipe assembly 120, e.g. in the first deposition area 201. The coating of an inner wall of the vacuum chamber can be reduced or avoided, and the cleaning can be simplified.

[0063] As is schematically depicted in FIG. 2B, the plurality of nozzles can be opened with the plurality of closing mechanisms 150, in order to allow the evaporated material to propagate from the distribution pipe assembly toward the first deposition area 201, where the substrate 10 to be coated may be arranged. The plurality of nozzles 130 may be opened at the same time, e.g. via a control system which may be configured to operate the plurality of closing mechanisms 150.

[0064] In some embodiments, the deposition source 200 may be configured for a translational movement. For example, the deposition source 200 may include a support which is configured to be guided on tracks in a vacuum chamber. The deposition source 200 may be moved past the substrate 10, e.g. in a horizontal direction, for depositing a material pattern on the substrate, while the plurality of nozzles 130 is in the open state I. The plurality of nozzles 130 may be closed after the movement of the deposition source 200 past the substrate. By closing the plurality of nozzles 130 subsequent to the deposition, the consumption of material can be reduced.

[0065] For example, after the deposition, the plurality of nozzles 130 may be closed in an idle position of the distribution pipe assembly 120 in which the distribution pipe assembly is serviced or cleaned, e.g. by heating. For example, the plurality of nozzles and/or a plurality of shaper shields which may be arranged in front of the plurality of nozzles may be cleaned in the idle position, e.g. by heating. [0066] The idle position may be a position in which the distribution pipe assembly is rotated, e.g. by a rotation angle of 90°, with respect to a deposition position of the distribution pipe assembly. In order to reduce or avoid a material consumption in the idle position, the plurality of nozzles may be closed in the idle position.

[0067] As is schematically depicted in FIG. 2C, in some embodiments, the deposition source 200 may be configured to be moved, e.g. turned or rotated, between the first deposition area 201 configured for arranging the substrate 10 and a second deposition area 202 configured for arranging a second substrate 11. During the movement of the deposition source 200 from the first deposition area 201 to the second deposition area 202, the plurality of nozzles 130 may be at least temporarily closed.

[0068] When the plurality of nozzles 130 is directed toward the second substrate 11 and the deposition source 200 is ready for evaporation, the plurality of nozzles may be opened with the plurality of closing mechanisms 150. The plurality of nozzles may remain open during the deposition on the second substrate 11. Thereafter, the nozzles may be closed again. Material consumption can be reduced.

[0069] It is noted that after the opening of the plurality of nozzles and before commencing with the deposition on a substrate, it may be beneficial to wait for a predetermined time interval in order to allow the plumes of evaporated material to stabilize. For example, when the plurality of nozzles has been switched from the closed state to the open state, a stabilization period of ten seconds or more, particularly of twenty seconds or more, may be beneficial before moving the distribution pipe assembly past a substrate.

[0070] In some embodiments, the distribution pipe assembly 120 may be configured for a rotational movement. For example, the distribution pipe assembly 120 may include a rotary drive configured for rotating the distribution pipe assembly 120 from the first deposition area 201 to a servicing area, an idle area and/or a second deposition area 202. In some embodiments, the distribution pipe assembly 120 may be configured to be rotated from the first deposition area 201 by about 90° to an idle area and or by about 180° to a second deposition area 202 which may be provided on an opposite side of a vacuum chamber.

[0071] FIG. 3 is a schematic top view of a deposition apparatus 1000 for depositing evaporated material on two or more substrates, e.g. on a substrate 10 and on a second substrate 11, according to some embodiments described herein.

[0072] The deposition apparatus 1000 includes a vacuum chamber 1001. A deposition source 300, e.g. a deposition source according to any of the embodiments described herein, is arranged in the vacuum chamber 1001. A first deposition area 201 and a second deposition area 202 which may be located on opposite sides of the deposition source are provided in the vacuum chamber 1001. A substrate 10 may be arranged in the first deposition area 201, and a second substrate 11 may be arranged in the second deposition area 202.

[0073] In some embodiments, the deposition source 300 may be configured to move sequentially past the first deposition area 201 for coating the substrate 10 and the second deposition area 202 for coating the second substrate 11. The plurality of nozzles 130 may be opened while the deposition source 300 moves past the first deposition area 201 so that evaporated material may be directed toward the substrate 10 that is arranged in the first deposition area 201. The substrate 10 may have an essentially vertical orientation. For example, the substrate 10 may be held by a substrate carrier in an essentially vertical orientation, wherein the substrate carrier may be configured for carrying the substrate 10 through the vacuum chamber 1001.

[0074] In some embodiments, a mask 20 may be arranged in front of the substrate 10, i.e. between the substrate 10 and the deposition source 300 during deposition. For example, the mask 20 may be a fine metal mask with an opening pattern configured for depositing a complementary material pattern on the substrate. Alternatively, the mask may be an edge exclusion mask.

[0075] In some embodiments, the plurality of nozzles 130 may be closed in a time interval between the deposition in the first deposition area 201 and the deposition in the second deposition area 202. For example, the plurality of closing mechanisms 150 may be set to the closed state during cleaning of the distribution pipe assembly or during a movement of the deposition source 300 from the first deposition area 201 to the second deposition area 202. In particular, the plurality of closing mechanisms may be set to the closed state during a rotational movement of the deposition source and/or when the deposition source is brought to an idle position.

[0076] In some embodiments, the plurality of nozzles 130 may be closed during a servicing or maintenance time of the deposition source 300. In some embodiments, the plurality of nozzles 130 may be closed during an alignment process of the substrate 10 and/or of the mask 20. In some embodiments, the plurality of nozzles 130 may be closed during an arrangement of a mask and/or of a substrate in the first deposition area and/or in the second deposition area, and/or during cleaning of one or more shaper shields which may be arranged in front of the nozzles.

[0077] The plurality of nozzles 130 may be opened while the deposition source 300 moves past the second deposition area 202 so that evaporated material may be directed toward the second substrate 11 that is arranged in the second deposition area. The second substrate may have an essentially vertical orientation. For example, the second substrate 11 may be held by a second substrate carrier in an essentially vertical orientation, wherein the second substrate carrier may be configured for carrying the second substrate 11 through the vacuum chamber 1001.

[0078] In some embodiments, a second mask 21 may be arranged in front of the second substrate 11, i.e. between the second substrate 11 and the deposition source 300 during deposition on the second substrate 11.

[0079] In some embodiments, which may be combined with other embodiments described herein, the deposition source 300 may include three or more evaporation crucibles 122 and three or more distribution pipes 121 which are in fluid connection with one of the three or more evaporation crucibles 122, respectively. The three or more distribution pipes may extend essentially parallel to each other in an essentially vertical direction. Nozzles may be provided in each of the distribution pipes along the length directions of the distribution pipes. For example, ten, thirty or more nozzles may be provided in the front wall of each of the three or more distribution pipes. The nozzles of a first distribution pipe, the nozzles of a second distribution pipe and/or the nozzles of a third distribution pipe may be inclined with respect to each other such that the respective plumes of evaporated material meet at the position of the substrate. Accordingly, the plurality of nozzles may consist of ninety or more nozzles, e.g. about 150 nozzles. Employing a deposition source 300 according to embodiments described herein may be beneficial for high quality display manufacturing, particularly OLED manufacturing.

[0080] In some embodiments, which may be combined with other embodiments described herein, the first deposition area 201 may be provided opposite to the second deposition area 202 in the vacuum chamber 1001. In some embodiments, the deposition source 300 may rotate by an angle of essentially 180° from the first deposition area 201 to the second deposition area 202.

[0081] According to embodiments, which can be combined with other embodiments described herein, the distribution pipes 121 may be elongated tubes including heating elements. The evaporation crucible 122 can be a reservoir for a material, e.g. an organic material, to be evaporated with a heating unit. For example, the heating unit may be provided within the enclosure of the evaporation crucible. According to embodiments, which can be combined with other embodiments described herein, the distribution pipes may provide line sources.

[0082] According to some embodiments, which can be combined with other embodiments described herein, the length of the distribution pipes may correspond to a height of a substrate onto which material is to be deposited. Alternatively, the length of the distribution pipes may be longer than the height of the substrates. Accordingly, a uniform deposition at the upper end of the substrate and/or the lower end of the substrate can be provided. For example, the length of the distribution pipes can be 1.3 m or more, for example 2.5 m or more.

[0083] According to embodiments, which can be combined with other embodiments described herein, the evaporation crucible may be provided at the lower end of the distribution pipe. The material, e.g. an organic material, can be evaporated in the evaporation crucible. The evaporated material may enter the distribution pipe at the bottom of the distribution pipe and may be guided essentially sideways through the plurality of nozzles in the distribution pipe, e.g. towards an essentially vertically oriented substrate.

[0084] According to embodiments which can be combined with other embodiments described herein, the deposition source 300 may be provided on a source track 30, e.g. a linear guide or a looped track. The source track 30 may be configured for a translational movement of the deposition source 300, e.g. in a horizontal direction H. Accordingly, a drive for the translational movement can be provided for the deposition source 300 at the source track 30 within the vacuum chamber 1001.

[0085] According to embodiments which can be combined with other embodiments described herein, a first valve 1002, for example a gate valve, may be provided which allows for a vacuum seal to an adjacent vacuum chamber, e.g. a routing chamber. The first valve 1002 can be opened for transport of the substrate or the mask into the vacuum chamber 1001 or out of the vacuum chamber 1001.

[0086] According to some embodiments, which can be combined with other embodiments described herein, a further vacuum chamber, such as maintenance vacuum chamber 1004 may be provided adjacent to the vacuum chamber 1001, as exemplarily shown in FIG. 3. The vacuum chamber 1001 and the maintenance vacuum chamber 1004 may be connected with a second valve 1003. The second valve 1003 may be configured for opening and closing a vacuum seal between the vacuum chamber 1001 and the maintenance vacuum chamber 1004. The deposition source 300 can be transferred to the maintenance vacuum chamber 1004 while the second valve 1003 is in an open state. Thereafter, the second valve 1003 can be closed to provide a vacuum seal between the vacuum chamber 1001 and the maintenance vacuum chamber 1004. If the second valve 1003 is closed, the maintenance vacuum chamber 1004 can be vented and opened for maintenance of the deposition source 300 without breaking the vacuum in the vacuum chamber 1001.

[0087] According to some embodiments, which can be combined with other embodiments described herein, the substrate 10 may be supported by a substrate carrier, which can connect to an alignment unit. The alignment unit may adjust the position of the substrate 10 with respect to the mask 20. The substrate 10 may be moved relative to the mask 20 in order to provide for a proper alignment between the substrate and the mask which may be beneficial for high quality display manufacturing. Accordingly, embodiments of the deposition apparatus as described herein provide for improved quality display manufacturing, particularly OLED manufacturing.

[0088] FIG. 4 is a schematic sectional view of a deposition source 400 according to some embodiments described herein. The deposition source 400 includes a distribution pipe assembly 120 with two or more distribution pipes 121. The sectional plane of FIG. 4 intersects through the two or more distribution pipes 121 at a position of the at least one nozzle 131 that is provided at a front side of the two or more distribution pipes 121.

[0089] At least one or more heat shields configured for reducing the heat radiation from the deposition source may surround an inner volume of one or more distribution pipes. In the embodiments of FIG. 4, each distribution pipe comprises at least two heat shields which surround the inner volume of a respective distribution pipe. Spacer elements may be arranged between two adjacent heat shields.

[0090] A closing mechanism 151 with a closing element 152 may be provided for opening and closing the at least one nozzle 131. The closing element 152 may be configured for closing a channel of the at least one nozzle so that no evaporated material can leave the distribution pipe 121 through the at least one nozzle in a closed state.

[0091] FIG. 5 is a schematic sectional view of a deposition source 500 according to some embodiments described herein. The deposition source 500 includes a distribution pipe assembly 120. One distribution pipe 121 of the distribution pipe assembly 120 is shown in FIG. 5. The sectional plane of FIG. 5 intersects through the distribution pipe 121 at a position of the at least one nozzle 131 that is provided in the front wall of the distribution pipe 121. [0092] A cooled shield may be arranged on a front side of the distribution pipe, in order to reduce the heat radiation from the deposition source toward the substrate during deposition.

[0093] A closing mechanism 151 with a closing element 152 may be provided for opening and closing the at least one nozzle 131. The closing element 152 may be configured for closing a channel of the at least one nozzle so that no evaporated material can leave the distribution pipe 121 through the at least one nozzle in a closed state.

[0094] FIG. 6. is a schematic sectional view of a deposition source 600 according to some embodiments described herein. The deposition source 600 includes a distribution pipe assembly 120 with one or more distribution pipes 121.

[0095] A plurality of nozzles 130 is provided in a side wall of the distribution pipe assembly 120 and directed toward a first deposition area 201. For example, the plurality of nozzles 130 is configured for directing evaporated material in a first direction XI where a substrate 10 may be arranged. Each nozzle of the plurality of nozzles 130 may be provided with a closing mechanism configured for opening and closing the respective nozzle of the plurality of nozzles 130. Reference is made to the above explanations which are not repeated here.

[0096] In some embodiments, which may be combined with other embodiments described herein, the distribution pipe assembly 120 may include a second plurality of nozzles 135 configured for directing evaporated material in a second direction X2, e.g. opposite to the first direction XI. For example, the second plurality of nozzles 135 may be configured for directing evaporated material to a second deposition area 202 where a second substrate 11 may be arranged.

[0097] In some embodiments, a plurality of closing mechanisms is provided for selectively blocking the (first) plurality of nozzles 130 and/or the second plurality of nozzles 135. For example, a (first) plurality of closing mechanisms 150 may be configured for opening and closing the (first) plurality of nozzles 130, and a second plurality of closing mechanisms 155 may be configured for opening and closing the second plurality of nozzles 135.

[0098] The deposition apparatus of FIG. 6 may be configured for the contemporaneous deposition on the substrate 10 and on the second substrate 11 which may be arranged in the first deposition area 201 and in the second deposition area 202, respectively. For example, the first plurality of closing mechanisms and the second plurality of closing mechanisms may be operated to open both the plurality of nozzles 130 and the second plurality of nozzles 135 at the same time.

[0099] In some embodiments, the deposition source 600 of FIG. 6 may temporarily direct evaporated material toward the first deposition area 201 only. For example, the (first) plurality of closing mechanisms 150 may be operated to open the plurality of nozzles 130, and the second plurality of closing mechanisms 155 may be operated to close the second plurality of nozzles 135.

[00100] In some embodiments, the deposition apparatus of FIG. 6 may be temporarily direct evaporated material toward the second deposition area 202 only. For example, the (first) plurality of closing mechanisms 150 may be operated to close the plurality of nozzles 130, and the second plurality of closing mechanisms 155 may be operated to open the second plurality of nozzles 135. Accordingly, in same embodiments, the deposition source may alternately direct evaporated material into two opposite directions, e.g. without being turned or rotated.

[00101] At least temporarily, the deposition apparatus of FIG. 6 may close both the plurality of nozzles 130 and the second plurality of nozzles 135, e.g. for service, maintenance, cleaning, alignment and/or in idle intervals.

[00102] The plurality of nozzles 130 and the second plurality of nozzles 135 may be provided in the same distribution pipe, e.g. on two opposite sides thereof. This has the advantage that the pressure in the distribution pipe may remain essentially constant when the plurality of nozzles 130 is closed and the second plurality of nozzles 135 is opened at approximately the same time, or vice versa. For example, the flow of evaporated material from the distribution pipe may remain constant, when the cross- sectional area of the first plurality of nozzles essentially corresponds to the cross- sectional area of the second plurality of nozzles, when switching the evaporation direction. This may reduce a waiting period for obtaining a stable flow of evaporated material after an activation of the closing mechanisms.

[00103] In some embodiments, the plurality of nozzles 130 and the second plurality of nozzles 135 may be provided in different distribution pipes. The two different distribution pipes may For example, different materials may be deposited on opposite sides of the deposition source contemporaneously and/or subsequently, e.g. on two different substrates or subsequently on the same substrate.

[00104] FIG. 7 is a flow diagram illustrating a method of depositing evaporated material on a substrate according to some embodiments described herein.

[00105] In box 710, a deposition source including a distribution pipe assembly with a plurality of nozzles and a plurality of closing mechanisms is provided. Each closing mechanism is configured for opening and closing an associated nozzle of the plurality of nozzles.

[00106] In box 720, evaporated material is directed from the plurality of nozzles toward the substrate. A material pattern or a material layer can be deposited on the substrate. During deposition, the plurality of nozzles may be set to an open state.

[00107] In some embodiments, in box 720, the deposition source may be moved past the substrate while the plurality of nozzles is opened, e.g. linearly and or at a constant speed.

[00108] In box 730, the plurality of nozzles is closed with the plurality of closing mechanisms. For example, the plurality of nozzles may be closed after the deposition on the substrate, e.g. for service, maintenance, adjustment of a deposition frequency, alignment, idle periods, and/or for moving the deposition source toward a second substrate. In some embodiments, the deposition source may be moved, turned and/or rotated from the substrate toward a second substrate while the plurality of nozzles is closed.

[00109] In box 740, evaporated material is directed from the plurality of nozzles toward the second substrate. The plurality of nozzles may be set again to the open state.

[00110] The first substrate may be arranged in a first deposition area during deposition, and the second substrate may be arranged in a second deposition area during deposition. The first deposition area and the second deposition area may be located on opposite sides of the deposition source.

[00111] In some embodiments, in box 740, the deposition source may be moved past the second substrate while the plurality of nozzles is opened.

[00112] Accordingly, the consumption of evaporated material can be reduced and a contamination of the vacuum chamber, e.g. during a rotation of the deposition source, can be reduced or avoided.

[00113] FIG. 8 is a flow diagram illustrating a method of depositing evaporated material on a substrate according to some embodiments described herein.

[00114] In box 810, a deposition source including a distribution pipe assembly with a plurality of nozzles and a plurality of closing mechanisms is provided. Each closing mechanism is configured for opening and closing an associated nozzle of the plurality of nozzles. The distribution pipe assembly further includes a second plurality of nozzles and a second plurality of closing mechanisms, wherein each closing mechanism of the second plurality of closing mechanisms is configured for opening and closing an associated nozzle of the second plurality of nozzles. [00115] The plurality of nozzles and the second plurality of nozzles may be directed in different directions, i.e. in a first direction XI and in a second direction X2, e.g. in opposite directions.

[00116] In box 820, the deposition source is moved past a substrate which is arranged in the first direction XI of the deposition source while the plurality of nozzles is opened and the second plurality of nozzles is closed.

[00117] In box 830, the deposition source is moved past a second substrate which is arranged in the second direction X2 of the deposition source while the plurality of nozzles is closed and the second plurality of nozzles is opened.