FIELD

The proposed apparatus relates to epidermal electronics - electronic devices that are thin and attached (affixed) to the user's skin with an adhesive.

BACKGROUND

This section is intended to introduce the reader to various aspects of art, which may be related to the present embodiments that are described below. This discussion is believed to be helpful in providing the reader with background information to facilitate a better understanding of the various aspects of the present disclosure. Accordingly, it should be understood that these statements are to be read in this light.

A big problem with current epidermal electronics is that electrodes are often glued to the skin and are painful to remove. Current removal approaches are mechanical or chemical. Current removal generally degrades or destroys the electronics.

SUMMARY

The proposed apparatus relates to epidermal electronics - electronic devices that are thin and attached (affixed) to the user's skin with an adhesive. These devices can be used for many purposes (such as sensing user physiology). As part of ongoing research epidermal electronics are being considered for use as input devices for augmented reality (AR)/virtual reality (VR) applications. For example, measuring the electrical impedance of the hand/wrist/arm to allow for gesture input to AR/VR. A currently common device in this category is a medical electrical electrode that is used for impedance measurements, heart rate monitoring, EMG/ECG measurements, etc. While AR and VR are different, they do have some feature(s) in common.

Current epidermal electronic devices are affixed to the skin with adhesive and are removed mechanically (like pulling off a band- aid/bandage) or chemically. The proposed apparatus uses a heat sensitive adhesive and a special structure in the device so that it can be removed automatically.

An aspect of the proposed apparatus is described including a heat sensitive adhesive layer, the heat sensitive layer adapted to be attached to skin of a user, a layer having at least one heating element affixed to the heat sensitive adhesive layer, the layer having the at least one heating element adapted to be heated by applying current to heat to a temperature sufficient to cause the heat sensitive layer to release from the skin of the user and a circuit layer affixed to the layer having the at least one heating element, the circuit layer wirelessly providing sensor information from the user.

In an embodiment of the proposed apparatus sensor information is biometric screening or biometric measurement information.

In another embodiment of the proposed apparatus sensor information is information adapted to wirelessly provide at least one of visual reality and augmented reality information.

Another embodiment of the proposed apparatus includes an additional layer that is affixed to the circuit layer, the additional layer is a temporary tattoo to hide the circuit.

In another embodiment of the proposed apparatus the circuit layer includes one or more of a processor, sensors, radios, antennas, RF coils and RF diodes.

In another embodiment of the proposed apparatus sensors include one or more of temperature sensors, ECG and EMG sensors.

In another embodiment of the proposed apparatus the at least one heating element is one of non-resistive and resistive.

In another embodiment, the layer having heating elements and the circuit layer are implemented on a same layer.

A second aspect is a method for operating an epidermal electronics apparatus including applying the epidermal electronics apparatus to skin, providing sensor information from the epidermal electronics apparatus and applying sufficient heat to the epidermal electronics apparatus through a layer having at least one heating element to cause the epidermal electronics apparatus to be released from the skin.

In an embodiment of the proposed method the sensor information includes at least one of biometric screening and biometric measurement.

In another embodiment of the proposed method the sensor information is used to provide at least one of augmented reality and virtual reality information.

In another embodiment of the proposed method the at least one heating element is one of non-resistive and resistive.

BRIEF DESCRIPTION OF THE DRAWINGS

The proposed method and apparatus is best understood from the following detailed description when read in conjunction with the accompanying drawings. The drawings include the following figures briefly described below: Fig. 1 A through E are examples of conventional epidermal electronics devices and using conventional removal mechanisms.

Fig. 2 is an exemplary embodiment of the proposed apparatus in accordance with the principles described herein.

Fig. 3 is a flowchart of an exemplary method of using the proposed epidermal electronics apparatus.

It should be understood that the drawing(s) are for purposes of illustrating the concepts of the disclosure and is not necessarily the only possible configuration for illustrating the disclosure.

DETAILED DESCRIPTION

The present description illustrates the principles of the present disclosure. It will thus be appreciated that those skilled in the art will be able to devise various arrangements that, although not explicitly described or shown herein, embody the principles of the disclosure and are included within its scope.

All examples and conditional language recited herein are intended for educational purposes to aid the reader in understanding the principles of the disclosure and the concepts contributed by the inventor to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions.

Moreover, all statements herein reciting principles, aspects, and embodiments of the disclosure, as well as specific examples thereof, are intended to encompass both structural and functional equivalents thereof. Additionally, it is intended that such equivalents include both currently known equivalents as well as equivalents developed in the future, i.e., any elements developed that perform the same function, regardless of structure.

Thus, for example, it will be appreciated by those skilled in the art that the block diagrams presented herein represent conceptual views of illustrative circuitry embodying the principles of the disclosure. Similarly, it will be appreciated that any flow charts, flow diagrams, state transition diagrams, pseudocode, and the like represent various processes which may be substantially represented in computer readable media and so executed by a computer or processor, whether or not such computer or processor is explicitly shown.

The functions of the various elements shown in the figures may be provided through the use of dedicated hardware as well as hardware capable of executing software in association with appropriate software. When provided by a processor, the functions may be provided by a single dedicated processor, by a single shared processor, or by a plurality of individual processors, some of which may be shared. Moreover, explicit use of the term "processor" or "controller" should not be construed to refer exclusively to hardware capable of executing software, and may implicitly include, without limitation, digital signal processor (DSP) hardware, read only memory (ROM) for storing software, random access memory (RAM), and nonvolatile storage.

Other hardware, conventional and/or custom, may also be included. Similarly, any switches shown in the figures are conceptual only. Their function may be carried out through the operation of program logic, through dedicated logic, through the interaction of program control and dedicated logic, or even manually, the particular technique being selectable by the implem enter as more specifically understood from the context.

In the claims hereof, any element expressed as a means for performing a specified function is intended to encompass any way of performing that function including, for example, a) a combination of circuit elements that performs that function or b) software in any form, including, therefore, firmware, microcode or the like, combined with appropriate circuitry for executing that software to perform the function. The disclosure as defined by such claims resides in the fact that the functionalities provided by the various recited means are combined and brought together in the manner which the claims call for. It is thus regarded that any means that can provide those functionalities are equivalent to those shown herein.

The proposed apparatus uses a heat sensitive glue. In particular, a glue that loses adhesion when it is heated above a given temperature (for example, 110 degrees Fahrenheit which is warmer than the body and the environment but not perceived by the user as "hot"). A variety of heat sensitive adhesives (glues) can be used. Each of the glues loses its adhesive property in a slightly different range so the temperature at which the adhesive property of the epidermal electronics is automatically released depends on the particular adhesive that is used. The epidermal electronics device is adhered to the user's skin with a heat sensitive adhesive. Additionally, the proposed apparatus also uses a heating element in the epidermal device. The heating element is one of a resistive coil or a non-resistive heating element. When the user wishes to remove the device, a current is applied (e.g., as part of an overall system feature under computer control). The current generates the required heat and the device detaches automatically.

The layer having the heating element may be a separate layer in the epidermal electronics, or the layer having heating element could fill in areas not occupied by the epidermal electronics circuit. It could also use the ground plane as the conductor applying a short circuit across that region. This heating element could be for the entire surface area, or only certain regions could have the glue and the restive circuit placed only in those corresponding areas. Other heating mechanisms could also be used such as Peltier devices, etc.

This could be a complex device with embedded CPU/sensors/radio e.g., for AR/VR control. The application of current could be under control of that device and triggered by the user or an application. Alternatively, the epidermal electronics could be a simple device such as a medical electrode that has the added heat sensitive adhesive and a layer having heating elements (resistive or non-resistive) and is triggered by some external signal to heat for the needed time to automatically detach from the user's skin.

Fig. 1 A through E are examples of conventional epidermal electronics devices and using conventional removal mechanisms. Example A, is an example of epidermal electronics for biometric screening or measurements. Such epidermal electronics may include antenna 105, light emitting diode (LED) 110, strain gauge 115, temperature sensor 120, wireless power coil 125, RF coil 130, RF diode 135, electrocardiogram (ECG)/electromyogram (EMG) sensor 140. Example B shows conventional epidermal electronics where a portion of the epidermal electronics unit is attached to the skin 145 and a portion of the epidermal electronics is detached from the skin 150. In the process of detaching conventional epidermal electronics from the skin of a user the circuitry is crumpled 155 and the polyester 160. Example C shows conventional epidermal electronics in an un-deformed state 165. The same conventional epidermal electronics in a compressed state 170 and the red dotted line indicates the boundary of the convention epidermal electronics 175. The same conventional epidermal electronics are shown in a stretched state 180. Example D shows a temporary tattoo 185 which hides the conventional epidermal electronics. The backside 190 of the temporary tattoo 185 which hides the conventional epidermal electronics shows the electronics inside a red dotted boundary line. The temporary tattoo 185 which hides the conventional epidermal electronics after the tattoo has been attached (integrated) onto a user's skin 195 for use is shown next. The temporary tattoo 185 which hides the conventional epidermal electronics, the tattoo may become deformed 197 during the process of removal or otherwise. The red dotted line boundary shows the deformation of the boundary. Example E shows temporary tattoos attached to a user's skin. Such temporary tattoos may or may not include epidermal electronics.

Fig. 2 is an exemplary embodiment of the proposed apparatus in accordance with the principles described herein. The proposed apparatus has multiple layers. The proposed epidermal electronics are attached to a user's skin 220. The proposed epidermal electronics includes a first layer of heat sensitive adhesive (glue) 205. A layer having heating elements (resistive or non-resistive) 210 is affixed to the layer of heat sensitive glue (adhesive). The layer having heating elements is shown as encompassing the entire layer, however, the layer having heating elements may encompass only a portion of the layer. For example, the layer having heating elements may be on the periphery of the layer thus, allowing additional circuitry to be included in this layer. The layer having heating elements is heated to a temperature sufficient to cause the heat sensitive layer to automatically release the entire epidermal electronic device from the user's skin. Different heat sensitive glues (adhesives) have slightly different temperature ranges that will cause the automatic release of the epidermal electronics to release. A goal is to select a heat sensitive glue (adhesive) that is above a user's normal temperature but not hot, where hot would cause the user pain or a burn but that is sufficiently hot to cause the automatic release of the epidermal electronics. An additional layer of circuitry 215 is also envisioned. The epidermal electronic circuitry may include a processor or CPU, sensors, radios, antennas, RF coils, RF diodes etc. Sensors may include, for example, ECG, EMG sensors, temperature sensors etc. It is also possible to include an additional layer of a temporary tattoo, which is especially useful for biometric epidermal circuitry used with children. The epidermal electronics circuitry is not limited to being used for biometric screening or measurements but may be used for AR/VR applications to sense and transmit hand and/or wrist movements to control the AR/VR environment. In an alternative embodiment, the layer having heating elements and the circuit layer may be one and the same.

Fig. 3 is a flowchart of an exemplary method of using the proposed epidermal electronics apparatus. At 305 the proposed epidermal electronics apparatus is affixed to skin of a user. At 310 the proposed epidermal electronics apparatus is used for its intended purpose, for example, biometric screening or biometric measurements or AR/VR control. At 315 after the proposed epidermal electronics apparatus is no longer needed, sufficient heat is applied to the proposed epidermal electronics apparatus to cause it to be automatically released from the skin of the user.

Fig. 4 is a chart of skin (surface) temperatures of a person at various points on the person's body. Surface body temperatures (skin temperatures) or what the user's skin may come into contact are important considerations. As can be seen from Fig. 4, the placement of the epidermal electronics apparatus (device) and its use determine a reasonable operating range. If the epidermal electronics apparatus (device) is placed in the underarm area or underclothes or is to be used while exercising then a higher temperature will be needed to cause the epidermal electronics apparatus (device) to automatically be released from the skin of the user. In most instances the epidermal electronics apparatus (device) will probably be placed on the torso, or hands/arms. A reasonable operating range for the selected heat sensitive glue (adhesive) could thus be as low as 86 °F (30 °C) to 122 °F (50 °C).

It is to be understood that the proposed method and apparatus may be implemented in various forms of hardware, software, firmware, special purpose processors, or a combination thereof. Special purpose processors may include application specific integrated circuits (ASICs), reduced instruction set computers (RISCs) and/or field programmable gate arrays (FPGAs). Preferably, the proposed method and apparatus is implemented as a combination of hardware and software. Moreover, the software is preferably implemented as an application program tangibly embodied on a program storage device. The application program may be uploaded to, and executed by, a machine comprising any suitable architecture. Preferably, the machine is implemented on a computer platform having hardware such as one or more central processing units (CPU), a random access memory (RAM), and input/output (I/O) interface(s). The computer platform also includes an operating system and microinstruction code. The various processes and functions described herein may either be part of the microinstruction code or part of the application program (or a combination thereof), which is executed via the operating system. In addition, various other peripheral devices may be connected to the computer platform such as an additional data storage device and a printing device.

It should be understood that the elements shown in the figures may be implemented in various forms of hardware, software or combinations thereof. Preferably, these elements are implemented in a combination of hardware and software on one or more appropriately programmed general-purpose devices, which may include a processor, memory and input/output interfaces. Herein, the phrase "coupled" is defined to mean directly connected to or indirectly connected with through one or more intermediate components. Such intermediate components may include both hardware and software based components.

It is to be further understood that, because some of the constituent system components and method steps depicted in the accompanying figures are preferably implemented in software, the actual connections between the system components (or the process steps) may differ depending upon the manner in which the proposed method and apparatus is programmed. Given the teachings herein, one of ordinary skill in the related art will be able to contemplate these and similar implementations or configurations of the proposed method and apparatus.

For purposes of this application and the claims, using the exemplary phrase "at feast one of A, B and C," the phrase means "only A, or only B, or only C, or any combination of A, B and C."