DETACHING AND ATTACHING DEVICE, PROCESSING MACHINE, AND PROCESSING HEAD

WIPO Patent Application WO/2020/179162

A1

A detaching and attaching device (1) is provided with: a main attachment plate (2) to which a main attached object (9) is attached; an accessory attachment plate (3) to which an accessory attached object (10) is attached; a suction attachment means (4) for detachably linking the main attachment plate (2) and the accessory attachment plate (3); and linking members (5) which are disposed between the main attachment plate (2) and the accessory attachment plate (3) and which are formed separately from the main attachment plate (2) and the accessory attachment plate (3). The linking members (5) are fixed to the accessory attachment plate (3). Protuberances (6) which project toward the linking members (5) are formed on the main attachment plate (2). A hole (7) into which each protuberance (6) fits is formed in each linking member (5). A first contacting surface (61) in the shape of a surface of revolution is formed on each protuberance (6). A second contacting surface (71) in the shape of a surface of revolution is formed on an inner surface of each hole (7). In a state in which a central axis (C1) of each protuberance (6) and a central axis (C2) of each hole (7) coincide, the first contacting surfaces (61) and the second contacting surfaces (71) are in contact with one another.

NAKAI HIDEKAZU (JP)
HASEGAWA MASAHIKO (JP)
NISHIO AKINORI (JP)

PCT/JP2019/047419

September 10, 2020

December 04, 2019

Click for automatic bibliography generation  

MITSUBISHI ELECTRIC CORP (JP)

B23K26/70; B23Q3/02; B23Q3/15; B23Q3/18

JP2012110907A	2012-06-14
JPH04104271U	1992-09-08
JPS6210985U	1987-01-23
JPH0417382U	1992-02-13
JPH07178546A	1995-07-18
CN203045163U	2013-07-10
CN207806910U	2018-09-04

TAKAMURA, Jun (JP)

View/Download PDF      PDF Help

Previous Patent: SEMICONDUCTOR DEVICE

Next Patent: ALKALI DEVELOPABLE PHOTOCURABLE THERMOSETTING RESIN COMPOSITION