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Patent Searching and Data


Title:
DETECTION DEVICE AND CONTACT METHOD
Document Type and Number:
WIPO Patent Application WO/2018/163675
Kind Code:
A1
Abstract:
A detection device comprises a chuck top (20) that holds a wafer W, a probe card (18) having a plurality of contact probes (18a) on the surface facing the wafer (W) that are provided on the chuck top (20) facing the wafer W, a pogo frame (23) that supports the surface of the probe card (18) on the opposite side from the wafer (W), a bellows (32) that surrounds the probe card (18) and the contact probes (18a) and forms a sealed space (S) when the wafer (W) is close to or in contact with the contact probes (18a), an exhaust route (34) for reducing the pressure in the sealed space (S), and a mechanical stopper (36) that is provided between the pogo frame (23) and the chuck top (20) and restricts the vertical inclination of the chuck top (20) when predetermined contact is formed between the wafer (W) and the contact probes (18a).

Inventors:
HYAKUDOMI TAKANORI (JP)
UEDA MASANORI (JP)
FUJIHARA JUN (JP)
KONISHI KENTAROU (JP)
Application Number:
PCT/JP2018/003384
Publication Date:
September 13, 2018
Filing Date:
February 01, 2018
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/66; G01R31/28
Domestic Patent References:
WO2016159156A12016-10-06
WO2014054377A12014-04-10
Attorney, Agent or Firm:
TAKAYAMA Hiroshi (JP)
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