Title:
DETERGENT COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2001/097268
Kind Code:
A1
Abstract:
A detergent composition which is less apt to corrode wiring materials and is highly effective in cleansing a semiconductor substrate or semiconductor element having fine particles or impurity metal particles adherent thereto. The detergent composition contains a reducing agent and has an oxidation-reduction potential (25°C) of +0.2 V or lower and a pH (25°C) of 3 to 12. Also provided is a method of cleansing a semiconductor substrate or semiconductor element with the detergent composition.
Inventors:
SAKAI AKIMITSU (JP)
TAMURA ATSUSHI (JP)
TAMURA ATSUSHI (JP)
Application Number:
PCT/JP2001/005091
Publication Date:
December 20, 2001
Filing Date:
June 14, 2001
Export Citation:
Assignee:
KAO CORP (JP)
SAKAI AKIMITSU (JP)
TAMURA ATSUSHI (JP)
SAKAI AKIMITSU (JP)
TAMURA ATSUSHI (JP)
International Classes:
C11D3/00; C11D7/02; C11D7/26; C11D7/34; C11D11/00; C23G1/20; H01L21/306; (IPC1-7): H01L21/304; C11D7/34; C11D7/26
Foreign References:
| JPH11138113A | 1999-05-25 | |||
| JPH11330023A | 1999-11-30 |
Other References:
See also references of EP 1310989A4
Attorney, Agent or Firm:
Hosoda, Yoshinori c/o Hosoda International Patent Office OMM Building 5th Floor (P.O. Box 26 7-31 Otemae 1-chome Chuo-ku, Osaka-chi Osaka, JP)
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