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Patent Searching and Data


Title:
DEVELOPING UNIT, SUBSTRATE TREATMENT DEVICE, DEVELOPING METHOD, AND SUBSTRATE TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2017/141737
Kind Code:
A1
Abstract:
A substrate in which the film of a metal-containing coating liquid has been exposed to a prescribed pattern is held by a spin chuck. Developing solution is supplied by a slit nozzle to the surface to be treated of the substrate which is supported by the spin chuck. A cleaning solution for removing the metal or dissolving the metal is supplied by a cleaning nozzle to the surface to be treated of the substrate after developing solution has been supplied.

Inventors:
TANAKA YUJI (JP)
ASAI MASAYA (JP)
HARUMOTO MASAHIKO (JP)
KANEYAMA KOJI (JP)
Application Number:
PCT/JP2017/004035
Publication Date:
August 24, 2017
Filing Date:
February 03, 2017
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/027; B05C11/08; G03F7/30; G03F7/32; H01L21/304
Foreign References:
JP2015075500A2015-04-20
US20150056542A12015-02-26
JP2015031923A2015-02-16
JP2011253185A2011-12-15
JP2009302277A2009-12-24
JPH06266119A1994-09-22
EP0042894A11982-01-06
Attorney, Agent or Firm:
FUKUSHIMA, Yoshito (JP)
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