DEVICE FOR ASSISTING PRODUCTION OF ASSEMBLY OF WIRE CONNECTIONS AND METHOD FOR PRODUCING ASSEMBLY OF WIRE CONNECTIONS

WIPO Patent Application WO/2010/038488

A1

Disclosed is a device for assisting the production of an assembly of wire connections whereby a plurality of wires with terminals can be fed continuously to a worker, and the wires with terminals can be taken out smoothly while being prevented from being scratched or damaged. The device for assisting the production of an assembly of wire connections comprises a bar feed member (30) constituted such that a plurality of wire holding bars capable of holding the ends of wires with terminals can be moved and supported while being arranged along a predetermined feeding direction (P), the wire holding bars can be set on the upstream side in the feeding direction (P), and the wire holding bars can be removed on the downstream side in the feeding direction (P), and a connector holding portion (60) provided on the downstream side in the feeding direction (P) and having a connector set portion to which a connector capable of inserting the ends of wires with terminals are set.

TANIGAWA, Satoshi (1-14, Nishisuehiro-cho, Yokkaichi-sh, Mie 58, 51000, JP)
谷川 聡 (〒58 三重県四日市市西末広町１番１４号 住友電装株式会社内 Mie, 51000, JP)

JP2009/053025

April 08, 2010

February 20, 2009

Click for automatic bibliography generation  

Sumitomo Wiring Systems, Ltd. (1-14, Nishisuehiro-cho Yokkaichi-sh, Mie 58, 51000, JP)
住友電装株式会社 (〒58 三重県四日市市西末広町１番１４号 Mie, 51000, JP)
TANIGAWA, Satoshi (1-14, Nishisuehiro-cho, Yokkaichi-sh, Mie 58, 51000, JP)

H01B13/012; H01B13/00

YOSHITAKE, Hidetoshi et al. (10th floor, Sumitomo-seimei OBP Plaza Bldg.4-70, Shiromi 1-chome,Chuo-ku, Osaka-sh, Osaka 01, 54000, JP)

View/Download PDF      PDF Help

Previous Patent: WAFER BONDING APPARATUS AND WAFER BONDING METHOD

Next Patent: WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE WIRING BOARD