Title:
DEVICE FOR BONDING FILM
Document Type and Number:
WIPO Patent Application WO/2016/186192
Kind Code:
A1
Abstract:
Provided is a device (1) for bonding a film (60) to a first surface (51) of a substrate (50). The device (1) has: a first unit (10) provided with a member supporting surface (12) that supports the substrate (50) so as to make the first surface (51) face outward; a film supporting surface (22) that supports a part of the film (60) using suction; a second unit (20) that tilts the film supporting surface (22) so as to form an acute angle relative to the first surface (12), with the film supporting surface (22) facing the first surface (12), and that holds the film supporting surface (22) with one end (22a) thereof close to the first surface (51); a roller (30); and a unit (41) that moves the first unit (10).
Inventors:
YAMAURA SEIJI (JP)
Application Number:
PCT/JP2016/064975
Publication Date:
November 24, 2016
Filing Date:
May 20, 2016
Export Citation:
Assignee:
NAGANO AUTOMATION CO LTD (JP)
International Classes:
B29C65/78
Domestic Patent References:
| WO2009031440A1 | 2009-03-12 | |||
| WO2010018628A1 | 2010-02-18 | |||
| WO2009125574A1 | 2009-10-15 |
Foreign References:
| JP2013022760A | 2013-02-04 | |||
| JP2002207205A | 2002-07-26 | |||
| JP2013078860A | 2013-05-02 |
Attorney, Agent or Firm:
IMAI, AKIRA (JP)
今井 彰 (JP)
今井 彰 (JP)
Download PDF: