DEVICE FOR CAUSING SUBSTRATE TO CONTACT PROBE CARD, AND SUBSTRATE INSPECTION APPARATUS PROVIDED WITH SAME

WIPO Patent Application WO/2014/021024

A1

Provided is a device for causing a substrate to contact a probe card that causes a substrate to contact the probe card of a substrate inspection apparatus enabling effective inspection of the electrical properties of a semiconductor device provided on the substrate. The device for causing a substrate to contact a probe card has: an arrangement platform (15) for transporting a wafer (W) together with a wafer plate (24) to a position opposing the probe card (19); a lifting device (15a) for causing the wafer (W) together with the wafer plate (24) to move toward the probe card (19) after the transport to cause a plurality of electrodes of a semiconductor device of the wafer (W) to come into contact with a plurality of probes (19b) of the probe card (19), and then causing the wafer (W) to move closer toward the probe card (19); a pressure-reducing channel (26) for reducing the pressure in the space (S) between the probe card (19) and the wafer plate (24) in order to maintain the contact between the electrodes of the semiconductor device and the probes (19b) of the probe card (19); and a lifting device (15a) for separating a chuck member (14) of the arrangement platform (15) from the wafer plate (24).

JPS62150733	SEMICONDUCTOR DEVICE
JPS63177536	MANUFACTURE OF SEMICONDUCTOR
JPH0645421	INTEGRATED CIRCUIT

YAMADA HIROSHI (JP)

PCT/JP2013/067159

February 06, 2014

June 18, 2013

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TOKYO ELECTRON LTD (JP)

H01L21/66; G01R31/26

WO2012026036A1

2012-03-01

JPH11251379A	1999-09-17
JPH0774219A	1995-03-17
JP2009276215A	2009-11-26
JP2002158154A	2002-05-31
JP2003022959A	2003-01-24

BECCHAKU, Shigehisa et al. (JP)
Role of another Shigehisa (JP)

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