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Title:
DEVICE FOR COOLING ARITHMETIC PROCESSING UNIT
Document Type and Number:
WIPO Patent Application WO/2022/172874
Kind Code:
A1
Abstract:
Provided is a device for cooling an arithmetic processing unit that can maintain heat dissipation without using metal. A device (1) for cooling an arithmetic processing unit (100) having a cooling member (7) that contacts the surface of the arithmetic processing unit (100), wherein the cooling member (7) is formed in a plate shape using a carbon-based porous ceramic material, and the cooling member (7) is cooled using a refrigerant (2). The arithmetic processing unit (100) and the cooling member (7) are immersed in the refrigerant (2), in the interior of the cooling member (7) there is a cooling member internal passage (27) through which gas passes, and the gas of the cooling member internal passage (27) is emitted as microbubbles to the refrigerant (2).

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Inventors:
ANZAI SATOSHI (JP)
Application Number:
PCT/JP2022/004455
Publication Date:
August 18, 2022
Filing Date:
February 04, 2022
Export Citation:
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Assignee:
ANZAI SATOSHI (JP)
International Classes:
H01L23/473; H05K7/20
Foreign References:
JP2001181066A2001-07-03
JP2016180185A2016-10-13
JP2020076529A2020-05-21
Attorney, Agent or Firm:
YANO INTERNATIONAL PATENT ATTORNEYS OFFICE, P.C. (JP)
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