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Title:
DEVICE FOR CORRECTING PIPE-END SHAPE OF UOE METALLIC PIPE
Document Type and Number:
WIPO Patent Application WO/2010/061745
Kind Code:
A1
Abstract:
Provided is a device for correcting the pipe-end shape, the device being capable of improving roundness without reducing working efficiency and causing mechanical damages to welded portions even when the pipe ends of UOE metallic pipes with various outer diameters are worked. The device, for correcting the pipe-end shape of a UOE metallic pipe, corrects the roundness of a pipe-end portion by pressurizing the pipe-end portion while the pipe-end portion is sandwiched between an inner surface-side die (15a, 15b) which is fixed to the top of an inner surface-side stand (12) and has the upper surface with an arc-shaped cross-section and an outer surface-side die (26a, 26b) which is fixed to the bottom of an outer surface-side stand (20) and has the lower surface with an arc-shaped cross-section.  The device is characterized in that the inner surface-side die (15a, 15b) and the outer surface-side die (26a, 26b) are each divided into multiple parts and fixed in such a manner that the space between the divided die parts is located in the central portion of each of the divided inner surface-side die (15a, 15b) and outer surface-side die (26a, 26b).

Inventors:
ABE, Makoto (5-33, Kitahama 4-chome, Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
阿部 慎 (〒41 大阪府大阪市中央区北浜四丁目5番33号 住友金属工業株式会社内 Osaka, 〒5410041, JP)
Application Number:
JP2009/069422
Publication Date:
June 03, 2010
Filing Date:
November 16, 2009
Export Citation:
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Assignee:
SUMITOMO METAL INDUSTRIES, LTD. (5-33, Kitahama 4-chome Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
住友金属工業株式会社 (〒41 大阪府大阪市中央区北浜四丁目5番33号 Osaka, 〒5410041, JP)
ABE, Makoto (5-33, Kitahama 4-chome, Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
International Classes:
B21D1/08; B21D3/14; B21D37/02
Foreign References:
JPH0426614U1992-03-03
JPS6127510U1986-02-19
JPS52109472A1977-09-13
JPS5794434A1982-06-11
JPH03155416A1991-07-03
Attorney, Agent or Firm:
SUGIOKA, Kanji et al. (K. SUGIOKA PATENT OFFICE, 2-5-10 Sonezaki, Kita-ku, Osaka-sh, Osaka 57, 〒5300057, JP)
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