Title:
DEVICE FOR CUTTING STRUCTURE AND METHOD FOR CUTTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/186171
Kind Code:
A1
Abstract:
Provided is a cutting device (20) capable of efficiently cutting an object to be cut (T) with a simple configuration. The cutting device (20) comprises: a gripping unit (40) including a first gripping piece (50a) and a second gripping piece (50b) that are capable of moving in an opening/closing direction to grip the object to be cut (T); a cutting unit (60) that is disposed side by side with the first and second gripping pieces (50a, 50b) and moves in a cutting direction, which is along the opening/closing direction, to cut the object to be cut (T); and position setting means (70a, 70b) for setting a cutting start position and a cutting end position on the basis of the positions of the first and second gripping pieces (50a, 50b) that are gripping the object to be cut (T).
Inventors:
HOSAKA YOSHINOBU
MURAOKA DAISUKE
YAMASAKI TAKANORI
MURAOKA DAISUKE
YAMASAKI TAKANORI
Application Number:
PCT/JP2018/011113
Publication Date:
October 11, 2018
Filing Date:
March 20, 2018
Export Citation:
Assignee:
KOBELCO CONSTR MACH CO LTD (JP)
International Classes:
E04G23/08
Domestic Patent References:
| WO2008114963A1 | 2008-09-25 |
Foreign References:
| JP2007146571A | 2007-06-14 | |||
| JP2005002688A | 2005-01-06 | |||
| JP2017008542A | 2017-01-12 | |||
| JPH06313365A | 1994-11-08 | |||
| JP2007146571A | 2007-06-14 | |||
| JP2005002688A | 2005-01-06 |
Other References:
See also references of EP 3584391A4
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
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