Title:
A DEVICE FOR CUTTING WAFERS BY WIRE AND ITS METHOD
Document Type and Number:
WIPO Patent Application WO/2010/000169
Kind Code:
A1
Abstract:
A device for cutting wafers by wire and its method, which grinds wafers by a steel wire web (2) formed by one steel wire guided multiple times around a wire guiding rolls (1) provided with grooves. Based on the principle that the diameter of the steel wire will become small gradually for the abrasion in the cutting, the pitch of the grooves in the guiding rolls is changed to inequal pitch. The inequal pitch becomes small in turn along the length direction of the rolls starting from the steel winding the rolls.
More Like This:
Inventors:
ZHOU, James, Jian (Rm 301，No. 15, Lane 368 Qingyu Road, Putuo District, Shanghai 3, 200333, CN)
Application Number:
CN2009/072132
Publication Date:
January 07, 2010
Filing Date:
June 04, 2009
Export Citation:
Assignee:
INNER MONGOLIA SUNNERGY CO., LTD. (Huhhot Export Processing Zone, West Jinchuan RdHuhhot, Inner Mongolia 0, 010080, CN)
内蒙古晟纳吉光伏材料有限公司 (中国内蒙古自治区呼和浩特市金川西路呼和浩特出口加工区, Inner Mongolia 0, 010080, CN)
内蒙古晟纳吉光伏材料有限公司 (中国内蒙古自治区呼和浩特市金川西路呼和浩特出口加工区, Inner Mongolia 0, 010080, CN)
International Classes:
B28D5/04; B26D1/553
Attorney, Agent or Firm:
BEIJING YUANZHONG INTELLECTUAL PROPERTY AGENT LTD. (Suite 1103, Prestige Tower No.2 BuildingA-29, Beisanhuanzhong Road, Xicheng District, Beijing 9, 100029, CN)
Download PDF:
Previous Patent: A METHOD, APPARATUS AND SYSTEM FOR ADJUSTING MULTIMEDIA ENCODING RATE
Next Patent: OPTICAL SWITCH
Next Patent: OPTICAL SWITCH