Title:
A DEVICE FOR CUTTING WAFERS BY WIRE AND ITS METHOD
Document Type and Number:
WIPO Patent Application WO/2010/000169
Kind Code:
A1
Abstract:
A device for cutting wafers by wire and its method, which grinds wafers by a steel wire web (2) formed by one steel wire guided multiple times around a wire guiding rolls (1) provided with grooves. Based on the principle that the diameter of the steel wire will become small gradually for the abrasion in the cutting, the pitch of the grooves in the guiding rolls is changed to inequal pitch. The inequal pitch becomes small in turn along the length direction of the rolls starting from the steel winding the rolls.
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Inventors:
ZHOU JAMES JIAN (CN)
Application Number:
PCT/CN2009/072132
Publication Date:
January 07, 2010
Filing Date:
June 04, 2009
Export Citation:
Assignee:
INNER MONGOLIA SUNNERGY CO LTD (CN)
ZHOU JAMES JIAN (CN)
ZHOU JAMES JIAN (CN)
International Classes:
B28D5/04; B26D1/553
Foreign References:
| CN201235584Y | 2009-05-13 | |||
| CN1938136A | 2007-03-28 | |||
| CN1953835A | 2007-04-25 | |||
| JPH10249701A | 1998-09-22 |
Other References:
WANQ CONG: "New Semiconductor Material Cutting Equipment-Multi wire saw", EQUIPMENT FOR ELECTRONIC PRODUCTS MANUFACTURING, no. 4, 20 April 2004 (2004-04-20), pages 63 - 64
Attorney, Agent or Firm:
BEIJING YUANZHONG INTELLECTUAL PROPERTY AGENT LTD. (Prestige Tower No.2 BuildingA-29, Beisanhuanzhong Road, Xicheng District, Beijing 9, CN)
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