Title:
DEVICE FOR FORMING METAL COATING AND METHOD FOR FORMING METAL COATING
Document Type and Number:
WIPO Patent Application WO/2024/075533
Kind Code:
A1
Abstract:
Provided are a device for forming a metal coating and a method for forming a metal coating, the device and method making it less likely for tarnishing of a metal coating to occur. This device 1 for forming a metal coating comprises an electrolytic head unit 10, a positive electrode 21 disposed in a liquid chamber 17, a solid electrolyte film disposed between the positive electrode and a negative electrode, a power supply unit 29 for applying a voltage between the positive electrode 21 and the negative electrode 22, an electrolytic solution introduction unit 41 for introducing an electrolytic solution L into the liquid chamber 17, an electrolytic solution discharge unit 42 for discharging the electrolytic solution L in the liquid chamber 17 from the liquid chamber 17, and a non-pulsation pump 45 for pumping the electrolytic solution L without pulsation. The operation of the non-pulsation pump 45 continuously introduces the electrolytic solution L into the liquid chamber 17 via the electrolytic solution introduction unit 41 without pulsation, and continuously discharges the electrolytic solution L in the liquid chamber 17 from the liquid chamber 17 via the electrolytic solution discharge unit 42 without pulsation.
Inventors:
MATSUKURA TAKASHI (JP)
AOKI TETSUYA (JP)
SATO MARI (JP)
UCHIDA CHIHIRO (JP)
AOKI TETSUYA (JP)
SATO MARI (JP)
UCHIDA CHIHIRO (JP)
Application Number:
PCT/JP2023/034282
Publication Date:
April 11, 2024
Filing Date:
September 21, 2023
Export Citation:
Assignee:
JCU CORP (JP)
International Classes:
C25D17/00; C25D5/02
Attorney, Agent or Firm:
HAYASHI Kazuyoshi et al. (JP)
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