DEVICE FOR FORMING THERMOSETTING RESIN FOAM PLATE AND METHOD OF MANUFACTURING THERMOSETTING RESIN FOAM PLATE

WIPO Patent Application WO/2010/126024

A1

Provided is a device for forming a thermosetting resin foam plate, the device being capable of manufacturing the foam plate without multiply layering unnecessary surface materials, capable of drying the foam plate at high speed, and capable of manufacturing the foam plate efficiently and stably. Also provided is a method used for the device, the method being capable of efficiently manufacturing a thermosetting resin foam plate. A thermosetting resin foam plate is manufactured as follows: a resin composite consisting of at least a thermosetting resin, a foaming agent, and a hardening agent is mixed by a mixer, the resin composite is continuously discharged onto a flexible surface material which is traveling and has air permeability, the upper surface of the resin composite is covered with the air permeable flexible surface material, and the resin composite is formed and hardened by causing the resin composite to pass through a forming device which comprises a conveyor provided with openings having an opening ratio of not less than 15% but not more than 80%. Despite the fact that the foam plate is formed and hardened using the conveyor, water vapor and foaming gas within the thermo setting resin composite can be effectively released because the conveyor is provided with the openings which have an opening ratio of not less than 15% but not more than 80%.

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INOUE YOSHIMITSU (JP)
ISHIO TADASHI (JP)

PCT/JP2010/057421

November 04, 2010

April 27, 2010

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ASAHI KASEI CONSTR MAT CO LTD (JP)
INOUE YOSHIMITSU (JP)
ISHIO TADASHI (JP)

B29C39/22; B29C39/16; B29C39/18; B32B5/24; B29K101/10; B29K105/04; B29L9/00

JPS5761534A	1982-04-14
JPS58112737A	1983-07-05
JPH05269722A	1993-10-19
JP2002292651A	2002-10-09
JP2002240073A	2002-08-28
JPH05309756A	1993-11-22
JPH09277278A	1997-10-28
JPS49133484A	1974-12-21
JP2005131820A	2005-05-26
JP2561575B2	1996-12-11
JP2561576B2	1996-12-11
JPH035973B2	1991-01-28

See also references of EP 2425954A4

HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)

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