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Title:
DEVICE FOR GRIPPING A SEMICONDUCTOR PLATE THROUGH A TRANSFER OPENING, USING THE CLOSURE OF THE OPENING
Document Type and Number:
WIPO Patent Application WO2004054755
Kind Code:
A3
Abstract:
The invention concerns a device (1) for gripping, through a transfer station opening (10) for a semiconductor plate processing installation, at least one semiconductor plate (11) having the shape of a disc, housed inside a container (14) of semiconductor plates located on one first side (15) of said opening, from a space (16) located on a second side (17) of said opening opposite the first side. Said device comprises: a mobile closure (1) capable of moving between a first position closing said opening, and a second position releasing said opening allowing access inside the container; means for moving (18) said closure between said first and second positions thereof, said displacement being located at least partly in a plane substantially parallel to the plane of said opening. Said device is characterized in that it comprises: means for gripping (2) at least one semiconductor plate (11), capable of partly penetrating inside said container beneath a plate and of gripping the latter by its peripheral part; means for moving (3) said gripping means from said space located on the second side of the opening towards the first side, or inversely; means for connecting (4) to said closure said means for moving the gripping means.

Inventors:
LERO CHRISTOPHE (FR)
ASTEGNO PIERRE (FR)
GAUDON ALAIN (FR)
Application Number:
PCT/FR2003/003688
Publication Date:
October 21, 2004
Filing Date:
December 12, 2003
Export Citation:
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Assignee:
RECIF SA (FR)
LERO CHRISTOPHE (FR)
ASTEGNO PIERRE (FR)
GAUDON ALAIN (FR)
International Classes:
B23Q7/04; B23Q11/08; H01L21/677; H01L21/687; (IPC1-7): H01L21/677; H01L21/00
Domestic Patent References:
WO2000047501A12000-08-17
WO2000051920A12000-09-08
Foreign References:
US6188323B12001-02-13
US5984610A1999-11-16
Other References:
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 13 5 February 2001 (2001-02-05)
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