Title:
DEVICE FOR INSPECTING TERMINALS OF SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/1997/044634
Kind Code:
A1
Abstract:
An inspecting device comprising an image pickup means which picks up the image of the package surface of a semiconductor package from above obliquely at a predetermined angle of elevation and an inspecting means which inspects the terminals of the semiconductor package based on the pickup data obtained by the image pickup means. The inspecting speed is increased and accurate measurement is achieved irrespective of the surface condition of an object to be inspected.
More Like This:
| JPH10318726 | THREE-DIMENSIONAL-DIMENSION MEASURING APPARATUS |
| JP3186658 | BOULDER STONE MEASURING METHOD BY REMOTE OPERATION |
| JPH10274560 | LIGHT PROJECTING DEVICE |
Inventors:
TANUKI TOMIKAZU (JP)
KURIHARA TAKASHI (JP)
UEDA TAKAHIRO (JP)
HAMACHI HISASHI (JP)
KURIHARA TAKASHI (JP)
UEDA TAKAHIRO (JP)
HAMACHI HISASHI (JP)
Application Number:
PCT/JP1997/001561
Publication Date:
November 27, 1997
Filing Date:
May 09, 1997
Export Citation:
Assignee:
KOMATSU MFG CO LTD (JP)
TANUKI TOMIKAZU (JP)
KURIHARA TAKASHI (JP)
UEDA TAKAHIRO (JP)
HAMACHI HISASHI (JP)
TANUKI TOMIKAZU (JP)
KURIHARA TAKASHI (JP)
UEDA TAKAHIRO (JP)
HAMACHI HISASHI (JP)
International Classes:
G01B11/00; G01B11/24; G01N21/88; G01N21/956; H01L21/66; (IPC1-7): G01B11/24; G01N21/88; H01L21/66; H05K13/08
Foreign References:
| JPH05180622A | 1993-07-23 | |||
| JPH04346011A | 1992-12-01 |
Download PDF: