Title:
DEVICE INSPECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2015/029742
Kind Code:
A1
Abstract:
Provided is a device inspection method that can restrict a load on a stage- movement motor to a fixed value or less. A prober (10) is provided with the following: a stage (11) that has an X-direction motor and a Y-direction motor and thereby is capable of moving with a wafer (W) mounted thereon, the wafer having formed thereon semiconductor devices with electrodes; and a probe card (17) disposed so as to face the stage (11). Solder bumps (27) are disposed so as to correspond to the semiconductor device electrodes, and the probe card (17) has a probe electrode (28) capable of engaging the solder bumps (27). After the probe electrode (28) is made to engage the solder bumps (27), when the electrical properties of the semiconductor devices are measured, the X-direction motor or Y-direction motor generates torque so as to keep the stage (11) from moving, but the maximum value of the torque generated by the X-direction motor or Y-direction motor is restricted to a prescribed value or less.
Inventors:
HATTA MASATAKA (JP)
ISHII KAZUNARI (JP)
ISHII KAZUNARI (JP)
Application Number:
PCT/JP2014/070956
Publication Date:
March 05, 2015
Filing Date:
August 01, 2014
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/66
Foreign References:
| JP2011504658A | 2011-02-10 | |||
| JP2000321303A | 2000-11-24 |
Other References:
See also references of EP 3041038A4
None
None
Attorney, Agent or Firm:
BECCHAKU, Shigehisa et al. (JP)
Role of another Shigehisa (JP)
Role of another Shigehisa (JP)
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