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Title:
DEVICE-LAYER-TRANSFERRED SUBSTRATE PRODUCTION METHOD AND DEVICE LAYER-TRANSFERRED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/008882
Kind Code:
A1
Abstract:
Provided is a method that is for transferring a device layer on a transparent substrate and that can be easily implemented at the wafer level in a large caliber with a high yield rate. This device-layer-transferred substrate production method comprises: a step for temporarily bonding, to a supporting substrate 15 using a temporary adhesive 16, a device-layer side of an SOI wafer 14 including a silicon layer 11, an insulator layer 12, and a device layer 13; a step for obtaining a thinned device wafer by removing the silicon layer 11 of the SOI wafer 14 until the insulator layer 12 is exposed; a step for applying a transfer adhesive 18 to a transparent substrate 17 and/or the insulator layer 12 being exposed in the thinned device wafer; a step for bonding, by means of the transfer adhesive 18, the transparent substrate 17 and the insulator layer 12 being exposed in the thinned device wafer; and a step for removing the supporting substrate 15, in a state where warpage is corrected if there is any warpage found in the thinned device wafer, the transparent substrate 17, and the bonded body thereof.

Inventors:
KONISHI, Shigeru (SHIN-ETSU CHEMICAL CO. LTD., 13-1, Isobe 2-chome, Annaka-sh, Gunma 95, 〒3790195, JP)
KUBOTA, Yoshihiro (SHIN-ETSU CHEMICAL CO. LTD., 13-1, Isobe 2-chome, Annaka-sh, Gunma 95, 〒3790195, JP)
KAWAI, Makoto (SHIN-ETSU CHEMICAL CO. LTD., 13-1, Isobe 2-chome, Annaka-sh, Gunma 95, 〒3790195, JP)
TOBISAKA, Yuji (SHIN-ETSU CHEMICAL CO. LTD., 13-1, Isobe 2-chome, Annaka-sh, Gunma 95, 〒3790195, JP)
Application Number:
JP2019/024300
Publication Date:
January 09, 2020
Filing Date:
June 19, 2019
Export Citation:
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Assignee:
SHIN-ETSU CHEMICAL CO., LTD. (6-1 Otemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
International Classes:
H01L21/02; C09J183/04; G02F1/13; G09F9/00; H01L21/304; H01L21/306; H01L27/12
Domestic Patent References:
WO2018083961A12018-05-11
Foreign References:
JP2015079832A2015-04-23
JP2010091687A2010-04-22
Attorney, Agent or Firm:
OKUYAMA, Shoichi et al. (7th Floor, Akasaka Eight One Building 13-5, Nagata-cho 2-chome, Chiyoda-k, Tokyo 14, 〒1000014, JP)
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