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Title:
DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING, METHOD FOR LOW-TEMPERATURE PRESSURE SINTERING AND POWER ELECTRONICS ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2014/135151
Kind Code:
A3
Abstract:
The invention relates to a device for the low-temperature pressure sintering of electric components (8) on a substrate (6), said device having a heatable upper die (1, 2, 3) and a heatable lower die. The device is characterised in that the upper die (1, 2, 3) and the lower die each have at least one pressure pad (4).

Inventors:
EISELE RONALD (DE)
RÖMER SÖREN (DE)
RUDZKI JACEK (DE)
Application Number:
PCT/DE2014/100067
Publication Date:
December 04, 2014
Filing Date:
February 26, 2014
Export Citation:
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Assignee:
DANFOSS SILICON POWER GMBH (DE)
International Classes:
H01L21/60; B30B15/06; H01L25/07
Foreign References:
EP1434261A12004-06-30
EP1983564A12008-10-22
EP1988570A12008-11-05
Attorney, Agent or Firm:
BOEHMERT & BOEHMERT (Martin LandolfNiemannsweg 133, Kiel, DE)
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