Title:
DEVICE MACHINING METHOD AND DEVICE MACHINING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/183126
Kind Code:
A1
Abstract:
This technique suppresses the anisotropy in the physical properties of an object to be scanned by an ion beam in FIB machining. This device machining method uses an ion beam to form a structure body. The device machining method comprises the step of forming the structure body while changing the position of the irradiation by the ion beam. In this step of forming the structure body, each region of the structure body is formed through a plurality of exposures using the same type of ion beam.
Inventors:
SUGII NOBUYUKI (JP)
MACHIDA SHUNTARO (JP)
MINE TOSHIYUKI (JP)
WATANABE KEIJI (JP)
FUJISAKI KOJI (JP)
KAWAMURA TETSUFUMI (JP)
RYUZAKI DAISUKE (JP)
MIURA KATSUYA (JP)
KINOSHITA MASAHARU (JP)
MACHIDA SHUNTARO (JP)
MINE TOSHIYUKI (JP)
WATANABE KEIJI (JP)
FUJISAKI KOJI (JP)
KAWAMURA TETSUFUMI (JP)
RYUZAKI DAISUKE (JP)
MIURA KATSUYA (JP)
KINOSHITA MASAHARU (JP)
Application Number:
PCT/JP2016/062472
Publication Date:
October 26, 2017
Filing Date:
April 20, 2016
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
H01J37/317
Domestic Patent References:
| WO2009020151A1 | 2009-02-12 |
Foreign References:
| JP2014044829A | 2014-03-13 | |||
| JP2014022601A | 2014-02-03 | |||
| JP2004510295A | 2004-04-02 | |||
| JP2002033070A | 2002-01-31 | |||
| JP2010177121A | 2010-08-12 |
Attorney, Agent or Firm:
TSUTSUI & ASSOCIATES (JP)
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