Title:
DEVICE MANUFACTURING METHOD AND COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/033970
Kind Code:
A1
Abstract:
Provided is a device manufacturing method which includes the following: a step for forming a first film on a substrate by using a composition which includes a polymerizable monomer and an oxidation inhibitor; and a step for forming a second film by curing the first film in a state where at least a portion of a mold having an uneven pattern is brought into contact with the first film, or after at least a portion of the mold was brought into contact with the first film. The oxidation inhibitor is a hindered amine compound and/or a hindered phenol compound having a molecular weight of at least 700. The composition satisfies the relationship (t0(T)-tx(T))/t0(T)×100≤13.0. The manufacturing method is for a device that includes the substrate and the second film disposed on the substrate. (In the formula, t0(T) is the height of a protrusion of an unevenness of a cured film having such unevenness, the unevenness being obtained as a result of the following: after a coating film is formed using the composition, the coating film is brought into contact with an unevenness of the mold, the unevenness being such that the depth of recesses is 3μm and the line width thereof is 5μm, and in that contact state, the coating film is cured. tx(T) is the height of the protrusion obtained after the cured film is heated from 25ºC to 260ºC over five minutes, is subsequently maintained at 260ºC for five minutes, and then cooled to 25ºC over 30 minutes.)
More Like This:
Inventors:
OSAKI TAKESHI (JP)
Application Number:
PCT/JP2016/074665
Publication Date:
March 02, 2017
Filing Date:
August 24, 2016
Export Citation:
Assignee:
TOYO GOSEI CO LTD (JP)
International Classes:
G02B5/20; B29C59/02; H01L21/027
Foreign References:
| JP2010034513A | 2010-02-12 | |||
| JP2010067935A | 2010-03-25 | |||
| JP2014093385A | 2014-05-19 | |||
| JP2011222732A | 2011-11-04 |
Attorney, Agent or Firm:
KURIHARA, Hiroyuki et al. (JP)
Download PDF: