Title:
DEVICE AND METHOD FOR ANISOTROPICALLY PLASMA ETCHING A SUBSTRATE
Document Type and Number:
WIPO Patent Application WO2003075323
Kind Code:
A3
Abstract:
Disclosed are a method for anisotropically plasma etching a substrate (59), particularly a silicon body, and a device for carrying out the inventive method. Said device comprises a chamber (53) and a plasma source for generating a high frequency electromagnetic alternating field, and a reaction area (20) for generating a plasma with reactive species inside the chamber (53). Said reactive species are created by the action of the alternating field on an etching gas and a passivating gas which is introduced particularly simultaneously thereto but in a spatially separated manner. Said device also comprises a means (5, 62, 63) with which at least one first sector (23, 33, 43) which is impinged upon by the etching gas and at least one second sector (22, 32, 42) which is impinged upon by the passivating gas are defined in the reaction area (20). The device further comprises a mixing area (21) which is arranged downstream from the reaction area (20) and in which the reactive species created from the caustic gas in the first sector (23, 33, 43) are mixed with the reactive species created from the passivating gas in the second sector (22, 32, 42) before acting on the substrate (59).
Inventors:
LAERMER FRANZ (DE)
BREITSCHWERDT KLAUS (DE)
KUTSCH BERND (DE)
BREITSCHWERDT KLAUS (DE)
KUTSCH BERND (DE)
Application Number:
PCT/DE2003/000676
Publication Date:
July 15, 2004
Filing Date:
March 05, 2003
Export Citation:
Assignee:
BOSCH GMBH ROBERT (DE)
LAERMER FRANZ (DE)
BREITSCHWERDT KLAUS (DE)
KUTSCH BERND (DE)
LAERMER FRANZ (DE)
BREITSCHWERDT KLAUS (DE)
KUTSCH BERND (DE)
International Classes:
H01L21/00; (IPC1-7): H01L21/00; H01J37/00
Domestic Patent References:
| WO2000036631A1 | 2000-06-22 |
Foreign References:
| US5273609A | 1993-12-28 | |||
| US5888907A | 1999-03-30 | |||
| US6042687A | 2000-03-28 | |||
| GB2327382A | 1999-01-27 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 0131, no. 07 (C - 576) 14 March 1989 (1989-03-14)
PATENT ABSTRACTS OF JAPAN vol. 0130, no. 44 (E - 710) 31 January 1989 (1989-01-31)
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 06 22 September 2000 (2000-09-22)
PATENT ABSTRACTS OF JAPAN vol. 0130, no. 44 (E - 710) 31 January 1989 (1989-01-31)
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 06 22 September 2000 (2000-09-22)
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