DEVICE AND METHOD FOR ATTACHING PROTECTIVE TAPE TO SEMICONDUCTOR WAFER

WIPO Patent Application WO/2019/207634

A1

The purpose of the present invention is to reduce the residual stress generated in a protective tape when attaching the protective tape to a semiconductor wafer. This attachment device 1 for attaching a protective tape PT to a semiconductor wafer W is provided with at least: a tape carrying mechanism 2 that carries the protective tape PT, which has been temporarily attached to a substrate BM, to a peel position; a tape holding body 30 that is capable of holding the protective tape PT; a holding body moving mechanism 31 that moves the tape holding body 30 to the peel position; and a peeling mechanism that, at the peel position, peels the substrate BM from the protective tape PT held by the tape holding body 30.

WO/2015/192256	ELECTRO-STATIC CHUCK WITH RADIOFREQUENCY SHUNT
JP6595296	Manufacturing method of protective tape and semiconductor device
WO/2017/044201	SUBSTRATE SUPPORT WITH REAL TIME FORCE AND FILM STRESS CONTROL

PRIEWASSER KARL HEINZ (DE)
KAKINUMA YOSHINORI (JP)
ISHIMATSU YOSUKE (JP)
IKEHATA KEN (JP)

PCT/JP2018/016543

October 31, 2019

April 24, 2018

Click for automatic bibliography generation  

DISCO HI TEC EUROPE GMBH (DE)
TAKATORI CORP (JP)

H01L21/683; H01L21/301; H01L21/304

JP2006339607A	2006-12-14
JP2014086532A	2014-05-12
JP2005159044A	2005-06-16

SAEGUSA & PARTNERS (JP)

View/Download PDF      PDF Help

Previous Patent: ALIGNMENT DEVICE AND ALIGNMENT METHOD

Next Patent: ELECTROLYSIS APPARATUS AND ELECTRIC DISCHARGE MACHINING APPARATUS