Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
DEVICE AND METHOD FOR BONDING THERMOELECTRIC ELEMENT
Document Type and Number:
WIPO Patent Application WO/2019/022345
Kind Code:
A1
Abstract:
The present invention relates to a device and method for bonding a thermoelectric element implemented to achieve high speed bonding of thermoelectric materials by means of instant heating when manufacturing a thermoelectric element or a thermoelectric module, and a main body unit receives an element arrangement substrate transferred through a transfer device and conveys the same, a preheating unit preheats, at a preset low temperature, the element arrangement substrate conveyed by the main body unit, an instant heating unit maintains a preset high temperature, receives the element arrangement substrate preheated by the preheating unit, and increases the temperature thereof to a preset instant heating temperature so as to perform instant heating, and a pressurizing unit pressurizes the element arrangement substrate when the instant heating unit performs instant heating, so as to bond the thermoelectric element at a high-speed.

Inventors:
CHO SANGHUM (KR)
PARK KWANHO (KR)
CHUNG JAEHWAN (KR)
Application Number:
PCT/KR2018/004632
Publication Date:
January 31, 2019
Filing Date:
April 20, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DAEYANG CO (KR)
International Classes:
H01L35/34; H01L35/04; H01L35/28
Foreign References:
JPH1168174A1999-03-09
JPH11307611A1999-11-05
JP2009088068A2009-04-23
KR20020026923A2002-04-12
JP2007537591A2007-12-20
Attorney, Agent or Firm:
NURY PATENT LAW FIRM (KR)
Download PDF: